MIL-PRF-38535K
APPENDIX A
A.4.3.2 Sampling. Statistical sampling for qualification and quality conformance inspections (QCIs) shall be in
accordance with the sampling procedures of appendix D of this specification, and as specified in the device
specification or drawing, as applicable. Reserve sample devices may be tested with the subgroups to provide
replacements in the case of test equipment failure or operator error (see A.4.3.5 and A.4.4.2.1.1). These devices
shall be used in predesignated order. Initial samples (and added samples, when applicable) shall be randomly
selected from the inspection lot or sublot, as applicable. After a test has started, the manufacturer may add an
additional quantity to the initial sample, but this may be done only once for any subgroup with a specified sample size
number (accept number). Add-on samples are not allowed for fixed sample size subgroups or for resubmitted lots.
The added samples shall be subjected to all the tests within the subgroup. The total samples (initial and added
samples) shall determine the new acceptance number. The total defectives of the initial and second sample shall be
additive and shall comply with the specified sample size number (accept number). The manufacturer shall retain
sufficient microcircuits from the lot to provide for additional samples.
A.4.3.2.1 Disposal of samples. Devices subjected to destructive tests or which fail any test shall not be shipped on
the contract or order as acceptable product. They may, however, be delivered at the request of the acquiring activity
if they are isolated from, and clearly identified so as to prevent their being mistaken for acceptable product. Sample
microcircuits, from lots which have passed quality assurance inspections or tests and which have been subjected to
mechanical or environmental tests specified in groups B, C, and D inspection and not classified as destructive, may
be shipped on the contract or order provided the test has been proved to be nondestructive (see A.4.3.2.3) and each
of the microcircuits subsequently passes final electrical tests in accordance with the applicable device specification.
A.4.3.2.2 Destructive tests. The following MIL-STD-883 tests, or other test as specified, shall be classified as
destructive:
Internal visual and mechanical (TM 2014).
Bond strength.
Solderability (for lead finishes B and C).
Moisture resistance.
Lead integrity.
Salt atmosphere.
SEM inspection for metallization.
Steady-state life test (accelerated).
Die shear strength test.
Total dose radiation hardness test.
Neutron irradiation.
Electrostatic discharge (ESD) sensitivity classification test.
Lid torque test.
Adhesion of lead finish.
Vibration, variable frequency.
Internal water vapor test.
Single-event-effects (ASTM F1192 or JESD57)
Dose-Rate Upset
Solder column pull test (TM 2038)
All other mechanical or environmental tests (other than those listed in A.4.3.2.3), shall be considered destructive
initially, but may subsequently be considered nondestructive upon accumulation of sufficient data to indicate that the
test is nondestructive. The accumulation of data from five repetitions of the specified test on the same sample of
product, without evidence of cumulative degradation or failure to pass the specified test requirements in any
microcircuit in the sample, is considered sufficient evidence that the test is nondestructive. Any test specified as a
100 percent screen shall be considered nondestructive for the stress level and duration or number of cycles applied
as a screen.
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ACTEL [ Actel Corporation ]
