MIL-PRF-38535K
APPENDIX A
A.3.6.13 Remarking. If sealed devices are remarked (to change or correct the marking as specified in A.3.6), the
reason for remarking, and a description of the process shall be recorded in the qualification test report and quality
conformance test record. In addition to the tests described below for qualification of the remarking procedure,
subgroup B-2 and internal visual and mechanical tests (TM 2014 of MIL-STD-883 with sample size/(accept no.) of
1(0) for class B devices and subgroups B-2a and B-2b (TM 2014 of MIL-STD-883 only) for class level S devices shall
be performed on each remarked lot to assure marking permanency and that markings and device type coincide. An
appropriate group A test, with a sample size/(accept no.) of 116(0), (100 percent for class level S) may be performed,
in lieu of internal visual and mechanical tests, to demonstrate that the markings and device types coincide.
Remarking procedures shall be approved by the qualifying activity. Approval shall be required once only for each
package material (e.g., lid, base) composition (regardless of package configuration), or at change of remarking
procedures or materials. For qualification of the remarking procedure, a sample of remarked devices shall be tested
to the following test methods according to TM 5005 of MIL-STD-883:
a. TM 2015, resistance to solvents (3 devices).
b. TM 1011, thermal shock (test condition B, 15 cycles minimum).
c. TM 1004, moisture resistance.
d. TM 1009, salt atmosphere.
NOTE: Electrical tests are not required. Visual inspection, after each test in accordance with applicable failure
criteria, shall be conducted.
A.3.7 Workmanship. Microcircuits shall be manufactured, processed, and tested in a careful and workmanlike
manner in accordance with good engineering practice, with the requirements of this appendix, and with the
production practices, workmanship instructions, inspection and test procedures, and training aids prepared by the
manufacturer in fulfillment of the quality assurance program (see A.4.8 herein).
A.3.7.1 Rework provisions. All rework (see A.3.1.3.16) permitted on microcircuits acquired under this appendix
shall be accomplished in accordance with procedures and safeguards documented in accordance with A.4.8.1.1.6
and available for review by the preparing and acquiring activity. In addition, all rework operations shall be clearly
identified on each process flowchart. Allowable rework of sealed packages includes recleaning of any microcircuit or
portion thereof, any rebranding (see A.3.6.13) to correct defective marking and lead straightening (provided the
reworked devices meet the requirements of A.4.6.2 for conditions of leads). For monolithic wafers of any class, the
strip and redeposition of a layer or additional processing to correct a nonconformance to a specification limit is not
allowed, except for the strip and redeposition of sacrificial layer(s) used exclusively as a masking function (e.g.,
photoresist, nitride, nitride glass). Documenting rework of these sacrificial layers on the flow chart is not required.
Continuation of processing is permitted and is considered allowable rework provided the manufacturer assures,
through evaluation, that no alteration in material film properties occurs (e.g. oxidation, corrosion, grain size, film
stress, adhesion) and baselined limits are met. Manufacturer shall document rework/continuation process work. The
strip and redeposition of backside metallization is considered allowable rework. No delidding or package opening for
rework shall be permitted for microcircuits of any class. For monolithic microcircuit wafers of any class, the strip and
redeposition of a layer or additional processing to correct a nonconformance to a specification limit is not allowed,
except as specified above. For class level S, any assembly rework operation prior to package seal is not allowed,
except as specified in A.3.7.1.1. Other than already stated in the rework provisions above, rework is not allowed for
class level S product without substantiating data and written approval of the qualifying activity.
A.3.7.1.1 Rebonding of monolithic devices. Visual criteria for rebonding and rebonding limitations for class level B
monolithic microcircuits shall be in accordance with TM 2010, Internal Visual (Monolithic), of MIL-STD-883, (see
3.2.1.4i and 3.2.1.5 of TM 2010 of MIL-STD-883). For class level S devices, rebonding is not allowed without
substantiating data and written approval of the qualifying activity. Rebonding of class level B shall be limited to the
bonding operation only.
74
ACTEL [ Actel Corporation ]
