MIL-PRF-38535K
APPENDIX A
A.4.4.2.6 Approval of other lead finishes. After qualification of one package type with a single lead finish, other
lead finishes may be approved by submitting a single device type for each additional lead finish in the previously
approved package family to group B, subgroup 3 and group D, subgroups 1, 3, 5, and 7 tests. Subgroup D-7 testing
should not be required for hot solder dip over lead finishes B or C (tin-lead, gold plate) which have been qualified on
the same package family.
A.4.4.2.7 Approval of other lead material. After the first lead material is qualified with a particular package family,
the new lead material for the package family can be considered qualified provided the required lead finish tests
specified (see A.4.4.2.6) with the addition of subgroup D-2, are successfully performed. Subgroup D-6 should be
completed when the lead frame extends into the die cavity.
A.4.4.2.8 Electrostatic discharge (ESD) sensitivity. ESD classification testing shall be done in accordance with
TM 3015 of MIL-STD-883 (The testing procedure defined within JESD22-A114 may be used as an alternate with
acceptable correlation data.), and the applicable device specification or drawing (see A.3.6.9.2). Devices shall be
handled in accordance with the manufacturer's in-house control documentation, which shall be maintained by the
manufacturer. Guidance for device handling is available in JESD625.
A.4.5 Quality conformance inspection (QCI).
A.4.5.1 General. Quality conformance inspection shall be conducted in accordance with the applicable
requirements of groups A, B, C, and D (and E if applicable) as specified herein or TM 5005 (or TM 5010 when
applicable) of MIL-STD-883, for the specified device class and TM 5007 of MIL-STD-883, when applicable.
Inspection lot sampling shall be in accordance with appendix D of this specification. Test results shall be recorded by
inspection lot identification code (see A.3.6.3) for each inspection lot.
A.4.5.2 Group A inspection. Group A inspection shall be performed on each inspection lot in accordance with
MIL-STD-883 and shall consist of electrical parameter tests specified for the specified device class. If an inspection
lot is made up of a collection of class level B splits or class level S inspection sublots, it shall be recombined into an
inspection lot before the group A inspection sample is taken or a group A inspection sample shall be taken from each
split or class level S inspection sublot.
A.4.5.3 Group B inspection. Group B inspection shall be performed in accordance with MIL-STD-883 on each
inspection lot for each package type and lead finish. As an alternate, except for class level S (at the manufacturer's
option) group B inspection may be performed on each package type and lead finish in accordance with 3.5.2 of TM
5005 or 3.4.2.1 of TM 5010 of MIL-STD-883. For class level S, group B, subgroups 1A, 2, 3, and 4 inspections shall
be performed on each sublot (split) when the manufacturer elects to keep the sublots (splits) separate from each
other after screen tests are completed. Except as otherwise specified in TM 5005 of MIL-STD-883, samples for this
inspection shall be completed and fully marked devices from lots which have been subjected to and passed the post
burn-in +25°C final electrical static tests (subgroup 1). Class level S steady-state life test, subgroup B-5, results shall
not be used to support class level B shipments.
A.4.5.4 Group C inspection for class level B only. Group C inspection (die-related tests) shall be in accordance
with MIL-STD-883 and shall include those tests specified which are performed periodically. Group C shall have been
completed on product with a die fabrication date code within four calendar quarters prior to the die fabrication date
code of product being submitted for acceptance. Group C tests are required for devices from each microcircuit group
(see A.3.1.3.13) in which a manufacturer is supplying product. Group C tests for each microcircuit group shall be
performed on one inspection lot of the most complex device type available at the time of selection from production
devices produced on each certified die fabrication line once per calendar year.
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ACTEL [ Actel Corporation ]
