欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QUA的Datasheet PDF文件第85页浏览型号5962-0421901QUA的Datasheet PDF文件第86页浏览型号5962-0421901QUA的Datasheet PDF文件第87页浏览型号5962-0421901QUA的Datasheet PDF文件第88页浏览型号5962-0421901QUA的Datasheet PDF文件第90页浏览型号5962-0421901QUA的Datasheet PDF文件第91页浏览型号5962-0421901QUA的Datasheet PDF文件第92页浏览型号5962-0421901QUA的Datasheet PDF文件第93页  
MIL-PRF-38535K  
APPENDIX A  
A.4 VERIFICATION  
A.4.1 Responsibility for inspection. Unless otherwise specified in the contract or order, the contractor is  
responsible for the performance of all inspection requirements as specified herein and in the device specification or  
drawing.  
A.4.1.1 Inspection during manufacture. The manufacturer shall establish and maintain in-process production  
controls, quality controls and inspections at appropriately located points in the manufacturing process in accordance  
with the procedures described in A.4.8.1.1 to assure continuous control of quality of materials, subunits, and parts  
during manufacture and testing. These controls and inspections shall be adequate to assure compliance with the  
applicable acquisition documentation and quality standards of microcircuits manufactured to this appendix and the  
applicable device specification or drawing.  
A.4.1.1.1 Metal package isolation test for class level S devices. Prior to die mounting, each metal-bodied package  
with leads glass-isolated within .005 inch (0.13 mm) of the metal body shall have 600 V dc applied between the case  
and leads not connected to the case. Packages which exhibit leakage greater than 100 nA shall be rejected.  
A.4.1.2 Control and inspection of acquisition sources. The manufacturer shall be responsible for assuring that all  
supplies and services used in the manufacture and test of microcircuits conform to all the requirements of this  
appendix, the device specification or drawing, and other provisions of the applicable acquisition documentation.  
A.4.1.3 Control and inspection records. The manufacturer shall maintain objective evidence documenting that  
each lot has been subjected to all processing controls, inspections, and tests accomplished in accordance with A.3  
and A.4 herein. Records shall be retained as specified in A.4.8.1.2.  
A.4.1.4 Government source inspection (GSI). Source inspection (GSI and contractor source inspection (CSI))  
shall be required only when specified in the order or subcontract. Notification of test initiation shall be given to the  
acquiring activity.  
A.4.1.5 Manufacturer control over its distributors. The manufacturer shall be responsible for assuring that its  
distributors maintain adequate controls to assure that products sold are of the same quality as products acquired  
directly from the manufacturer.  
A.4.1.6 Distributor inventory, traceability and handling control. Distributors shall, as a minimum, maintain adequate  
inventory control system, traceability documentation required by this specification and their appropriate certification,  
adequate handling, storage, and repackaging methods to protect quality and prevent damage and degradation of  
products.  
A.4.2 Solderability. All parts shall be capable of passing the solderability tests in accordance with TM 2003 of MIL-  
STD-883, on delivery.  
A.4.3 General inspection conditions. The general requirements of MIL-STD-883 shall apply.  
A.4.3.1 Classification of inspections and tests. The inspections and tests required to assure conformance to the  
specified quality assurance levels of microcircuits or lots thereof are classified as follows:  
Requirement  
Paragraph  
Qualification procedures  
Quality conformance inspection  
Screening  
Test results  
Quality Assurance Program  
A.4.4  
A.4.5  
A.4.6  
A.4.7  
A.4.8  
75