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5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.4.5.4.1 Group C sample selection. Samples selected for group C inspection shall meet all of the following  
requirements:  
a. Shall be chosen at random from any inspection lot comprised only of die from the quarter of the year (see  
A.3.6.3.1) for which quality conformance inspection is being established in a particular microcircuit group  
(see A.3.1.3.13 and tables A-VI, A-VII, A-VIII, and A-IX) for each certified die fabrication line.  
b. Shall be chosen from an inspection lot that has been submitted to and passed group A quality conformance  
inspection (QCI) (regardless of whether that inspection lot has been submitted and passed group B QCI).  
c. The inspection lot from which the samples are selected shall be the one with the most complex device type  
available at the time of selection.  
d. On multichip microcircuits, the group C die fabrication date code requirement shall be determined by  
considering only the latest date code of the most complex die contained within the package.  
A.4.5.4.1.1 Microcircuit group assignments. Microcircuits group assignments and technologies/die family  
assignments shall be as specified in tables A-VI, A-VII, A-VIII, A-IX, and A.3.1.3.13. Microcircuit groups shall be  
structured such that they appropriately group all of the devices produced by the manufacturer, including those that do  
not coincide with any of the current microcircuit groups listed. In the tables, each number represents a different  
microcircuit group. Each letter in the top row of the table represents a different technology group. Each table entry in  
the line below the technologies (e.g., Standard TTL, Schottky TTL, CMOS, etc.) represent a separate die family  
(e.g., 93, 93H, LS, etc).  
A.4.5.4.1.2 Product acceptable for delivery. Product shall be acceptable for delivery only after the successful  
completion of all group C testing and shall be comprised of die meeting the following requirements:  
a. Manufactured on the same die fabrication line as the sample selected for A.4.5.4.1.  
b. In the same microcircuit grouping as the sample selected in A.4.5.4.1.  
c. Which was started (or completed, at the manufacturer's pre-designated option) within the same  
year the sample selected in A.4.5.4.1.  
d. Group C coverage is required for each year of material production on each microcircuit group.  
NOTE: The above group C inspection and corresponding marking system shall be implemented on all devices with  
an inspection lot date code (seal week) of 8840 and later for JAN product and 8939 and later for non-JAN product.  
Inspection lots formed using die fabricated prior to 1988 for JAN product and prior to 1989 for non-JAN product  
shall be grandfathered according to the previous group C QCI requirements and marked with "GF" for the die fab  
symbolization (see A.3.6.3.1).  
A.4.5.5 Group D inspection. Group D inspection (package related tests) shall be in accordance with table V as  
specified herein or test method 5005 of MIL-STD-883 and shall include those package or case related tests which are  
performed periodically. Group D tests shall be performed every 26 calendar weeks on each package family for each  
assembly line (traceable to the inspection lot identification code of the week tested). If no production is performed for  
an extended period of time, coverage can be reestablished on the next available production run for the package  
family in need of coverage. Group D results can be used to support any class provided all of the group D sampling  
criteria are met. Each additional lead finish for each package family shall be subjected to subgroups 3, 5, and 7 of  
group D. Subgroup D-7 testing is not required for hot solder dip over lead finishes B or C (tin-lead, gold plate) which  
have been periodically tested for quality conformance inspection on the same package family. For hot solder dipped  
leadless chip carriers, the B3 and L3 dimensions may be measured prior to solder dip. In addition, laser marked  
devices for each package family, which do not have group D coverage for laser marking, shall be subjected to  
subgroups 3 and 5 of group D.  
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