MIL-PRF-38535K
APPENDIX A
A.4.5.4.1 Group C sample selection. Samples selected for group C inspection shall meet all of the following
requirements:
a. Shall be chosen at random from any inspection lot comprised only of die from the quarter of the year (see
A.3.6.3.1) for which quality conformance inspection is being established in a particular microcircuit group
(see A.3.1.3.13 and tables A-VI, A-VII, A-VIII, and A-IX) for each certified die fabrication line.
b. Shall be chosen from an inspection lot that has been submitted to and passed group A quality conformance
inspection (QCI) (regardless of whether that inspection lot has been submitted and passed group B QCI).
c. The inspection lot from which the samples are selected shall be the one with the most complex device type
available at the time of selection.
d. On multichip microcircuits, the group C die fabrication date code requirement shall be determined by
considering only the latest date code of the most complex die contained within the package.
A.4.5.4.1.1 Microcircuit group assignments. Microcircuits group assignments and technologies/die family
assignments shall be as specified in tables A-VI, A-VII, A-VIII, A-IX, and A.3.1.3.13. Microcircuit groups shall be
structured such that they appropriately group all of the devices produced by the manufacturer, including those that do
not coincide with any of the current microcircuit groups listed. In the tables, each number represents a different
microcircuit group. Each letter in the top row of the table represents a different technology group. Each table entry in
the line below the technologies (e.g., Standard TTL, Schottky TTL, CMOS, etc.) represent a separate die family
(e.g., 93, 93H, LS, etc).
A.4.5.4.1.2 Product acceptable for delivery. Product shall be acceptable for delivery only after the successful
completion of all group C testing and shall be comprised of die meeting the following requirements:
a. Manufactured on the same die fabrication line as the sample selected for A.4.5.4.1.
b. In the same microcircuit grouping as the sample selected in A.4.5.4.1.
c. Which was started (or completed, at the manufacturer's pre-designated option) within the same
year the sample selected in A.4.5.4.1.
d. Group C coverage is required for each year of material production on each microcircuit group.
NOTE: The above group C inspection and corresponding marking system shall be implemented on all devices with
an inspection lot date code (seal week) of 8840 and later for JAN product and 8939 and later for non-JAN product.
Inspection lots formed using die fabricated prior to 1988 for JAN product and prior to 1989 for non-JAN product
shall be grandfathered according to the previous group C QCI requirements and marked with "GF" for the die fab
symbolization (see A.3.6.3.1).
A.4.5.5 Group D inspection. Group D inspection (package related tests) shall be in accordance with table V as
specified herein or test method 5005 of MIL-STD-883 and shall include those package or case related tests which are
performed periodically. Group D tests shall be performed every 26 calendar weeks on each package family for each
assembly line (traceable to the inspection lot identification code of the week tested). If no production is performed for
an extended period of time, coverage can be reestablished on the next available production run for the package
family in need of coverage. Group D results can be used to support any class provided all of the group D sampling
criteria are met. Each additional lead finish for each package family shall be subjected to subgroups 3, 5, and 7 of
group D. Subgroup D-7 testing is not required for hot solder dip over lead finishes B or C (tin-lead, gold plate) which
have been periodically tested for quality conformance inspection on the same package family. For hot solder dipped
leadless chip carriers, the B3 and L3 dimensions may be measured prior to solder dip. In addition, laser marked
devices for each package family, which do not have group D coverage for laser marking, shall be subjected to
subgroups 3 and 5 of group D.
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ACTEL [ Actel Corporation ]
