MIL-PRF-38535K
APPENDIX A
A.3.1.3.28 Custom microcircuit. A nonstandard microcircuit, the design, and right(s) to the design (for example,
ownership, control, or proprietary rights) of which are under the control of the purchaser-user of the microcircuit.
A.3.1.3.29 Die family. All devices manufactured by the same basic process (e.g., low power Schottky, high speed
CMOS (HCMOS), Bipolar linear, CMOS linear, MOS memory, etc.) as specified in tables A-VI, A-VII, A-VIII, and A-IX.
A.3.1.3.30 Package family. A set of package types with the same package configuration (e.g., side brazed, bottom
brazed) material type (e.g., alumina, beryllium oxide (BeO)) package construction techniques (e.g., single layer,
multilayer) terminal pitch, except for can packages in which pin circle diameter can be used in place of terminal pitch,
lead shape (e.g., gullwing, J-hook), and row-spacing (e.g., dual-in-line packages only) and with identical package
assembly techniques (e.g., material and type of seal, wire bond method and wire size, die attach method and
material).
A.3.1.3.31 Military operating temperature range. The military temperature range or military operating temperature
range is defined as -55°C to +125°C.
A.3.1.3.32 Process monitor. The regularly scheduled periodic sample measuring of a parameter during normal
performance of production operations in accordance with the manufacturer’s approved program plan. The parameter
to be measured, the frequency of measurement, the number of sample measurements, the conditions of
measurement, the analysis of measurement data shall vary as a function of the requirements, capability and criticality
of the operation being measured.
A.3.1.3.33 Device specification. The terms device specification or Standard Microcircuit Drawing (SMD) shall be
used exclusively to reference or describe Government published documents with the combined purposes of
standardization and procurement which detail the specific requirements of performance based microcircuits.
A.3.1.3.34 Class level B. Class level B requirements contained in this document are intended for use for class Q
and class M products, as well as class B M38510 JAN slash sheet product. Class level B requirements are also
intended for use for product claimed as 883 compliant or 1.2.1 compliant for high reliability military applications.
A.3.1.3.35 Class level S. Class level S requirements contained in this document are intended for use for class V
or class Y and slash sheet M38510 JAN product. Class level S requirements are also intended for use for product
claimed as 883 compliant or 1.2.1 compliant for space level applications.
A.3.2 Item requirements. The individual item requirements for microcircuits delivered under this appendix shall be
documented in the device specification or SMD or other drawing (SMD format, in accordance with MIL-HDBK-780,
shall be used for drawings). Unless otherwise specified in the device specification or drawing, all devices procured
under this appendix shall have an operating ambient temperature range from -55°C to +125°C and any references to
minimum or maximum operating temperatures shall refer to the respective lower and upper limits of this range.
Contractor-prepared specifications or drawings shall be approved by the acquiring activity as acceptable for the
requirements of a specific contract or order, at the time of acquisition.
A.3.2.1 Electrical test requirements. The electrical test requirements (parameters, test conditions, test limits, and
applicable test temperatures) which apply to electrical screening (e.g., final electrical parameters), group A Quality
Conformance Inspection (QCI), and end-point electrical testing for other QCI subgroups shall be clearly documented
by the manufacturer as to the actual parameters, conditions, methods, limits, burn-in/life test circuits, and test
temperatures used in device testing. All those parameters important to the design application of the device shall be
specified over the full military operating temperature range and supply voltage range and be included in the testing
requirements of the applicable specification(s). For devices whose initial release date is after 29 May 1987, the
subgroups to be tested, and the parameters that constitute a subgroup shall, as a minimum, be equivalent to those of
the most similar device specification or drawing. The manufacturer's electrical test specification shall be documented
in a device specification table I format, or equivalent, that is clear to the user and shall be available to the user upon
request.
52
ACTEL [ Actel Corporation ]
