MIL-PRF-38535K
APPENDIX A
A.3.1.2 Conflicting requirements. In the event of conflict between the requirements of this appendix, this
specification and other requirements of the applicable device specification, the precedence in which requirements
shall govern, in descending order, is as follows:
a. Applicable device specification or drawing.
b. This appendix.
c. Specifications, standards, and other documents referenced in A.2.2 and A.2.3.
A.3.1.3 Terms, definitions, symbols and requirements. For the purpose of this appendix, the terms, definitions,
and symbols of MIL-STD-883 and MIL-HDBK-1331, and those contained herein shall apply and shall be used in the
applicable device specifications or drawings wherever they are pertinent. The definitions of part, subassembly,
assembly, unit, group, set, and system, as well as the ancillary terms accessory and attachment are contained in
MIL-HDBK-505. To further define a particular type of microcircuit, additional modifiers may be prefixed.
A.3.1.3.1 Microelectronics. The area of electronic technology associated with or applied to the realization of
electronic systems from extremely small electronic parts or elements.
A.3.1.3.2 Element (of a microcircuit or integrated circuit). A constituent of the microcircuit, or integrated circuit, that
contributes directly to its operation. (e.g., A discrete part incorporated into a microcircuit becomes an element of the
microcircuit.)
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit). The supporting material upon or within which the
elements of a microcircuit or integrated circuit are fabricated or attached.
A.3.1.3.4 Integrated circuit (microcircuit) . A small circuit having a high equivalent circuit element density, which is
considered as a single part composed of interconnected elements on or within a single substrate to perform an
electronic circuit function. (e.g., This excludes printed wiring boards, circuit card assemblies, and modules composed
exclusively of discrete electronic parts.)
A.3.1.3.4.1 Multichip microcircuit. An integrated circuit or microcircuit consisting of elements formed on or within
two or more semiconductor chips which are separately attached to a substrate or package.
A.3.1.3.4.2 Hybrid microcircuit. A microcircuit consisting of elements that are a combination of the film microcircuit
type (see A.3.1.3.4.4) and the semiconductor types (see A.3.1.3.4.1 and A.3.1.3.4.3) or a combination of one or both
of the types with discrete parts.
A.3.1.3.4.3 Monolithic microcircuit (or integrated circuit). A microcircuit consisting exclusively of elements formed
in situ on or within a single semiconductor substrate with at least one of the elements formed within the substrate.
A.3.1.3.4.4 Film microcircuit (or film integrated circuit). A microcircuit consisting exclusively of elements which are
films formed in situ upon an insulating substrate.
A.3.1.3.5 Microcircuit module. An assembly of microcircuits or an assembly of microcircuits and discrete parts,
designed to perform one or more electronic circuit functions, and constructed such that for the purposes of
specification testing, commerce, and maintenance, it is considered indivisible.
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