MIL-PRF-38535K
APPENDIX A
A.3.2.2.2 Die evaluation requirements. The following requirements shall be met for each wafer lot. The results of
this evaluation shall demonstrate compliance to this appendix for wafer manufacturing requirements.
a. Functional diagram and high power photomicrographs.
b. Analysis of internal conductor materials.
c. Composition of glassivation material and thickness measurement.
d. Total die thickness measurement.
e. SEM analysis of metallization.
f. Adhesion of gold backing.
g. Calculated current density in accordance with this appendix.
A.3.3 Classification of requirements. The requirements of the microcircuits are classified herein as follows:
Requirement
Paragraph
Quality assurance requirements
Qualification
A.3.4
A.3.4.1
A.3.4.1.1
A.3.4.1.2
A.3.4.1.3
A.3.4.1.4
A.3.4.2
A.3.4.3
A.3.4.4
A.3.4.5
A.3.4.6
A.3.5
Compliance validation
Process Monitor Programs
Qualification to RHA levels
Qualification to ESD classes
Change to product or QA program
Screening
Quality conformance inspection
Wafer lot acceptance
Traceability
Design and construction
Marking of microcircuits
Workmanship
A.3.6
A.3.7
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ACTEL [ Actel Corporation ]
