MIL-PRF-38535K
APPENDIX A
A.3.2.2 Alternate die/fabrication requirements. When deemed necessary by the preparing or acquiring activity,
(e.g., a class M SMD device, a DLA Land and Maritime drawing device, a MIL-STD-883 compliant device, or a
Qualified Products List/Qualified Manufacturers List (QPL/QML) device or a unique package/die combination is not
available from a DLA Land and Maritime drawing, SMD, QML, or QPL source that meets the full wafer fabrication
requirements of this appendix), the DLA Land and Maritime drawing, SMD, JAN specification sheet or other
procurement document (e.g., contractor-prepared drawing for “D” certification only) may be modified to provide a
source for logistics support. This modification shall allow either a detailed certificate of compliance (itemized listing of
die fabrication requirements from this appendix - see example in A.3.2.2.1 herein) or a die evaluation as defined by
A.3.2.2.2 herein to be used in lieu of meeting the full die/fabrication requirements of this appendix. Alternate die
fabrication requirements of A.3.2.2.1 and A.3.2.2.2 are permitted only for product that does not have the required
traceability of A.3.4.6. These alternate requirements are acceptable only when the manufacturer planning to use this
allowance has information on the wafer lot number, date of fabrication of the die, the fabrication line where the die
was processed, and that the die was previously qualified by a QML/QPL manufacturer (for QML product) or by a MIL-
STD-883 compliant manufacturer (for MIL-STD-883 compliant product). The manufacturer that meets the
die/fabrication requirements of A.3.2.2.1 or A.3.2.2.2 is required to perform QCI testing of groups C and D (and E if
applicable) on the first inspection lot of each wafer lot and shall replace the “C” certification mark with a “D”
certification mark. An additional complete group D test is not required if the manufacturer already has group D
coverage on the package family; however, subgroups D3 and D4 shall be required on the first inspection lot of the
wafer lot. For excess die from the evaluated wafer lot, an additional group C and group D (subgroups D3 and D4
only) tests are not required for subsequent inspection lots built solely from die from that wafer lot. If the product is
built in full compliance to the requirements of this appendix (the alternate die/fabrication allowance of A.3.2.2 is not
being used), the “C” certification mark shall be used on the device.
A.3.2.2.1 Example C of C. This C of C from the wafer manufacturer certifies that the product identified by
fabrication code XXXXXX meets the fabrication requirements of appendix A of MIL-PRF-38535 (1.2.1 of MIL-STD-
883) including the following itemized requirements:
a. Change to product requirement of A.3.4.2.
b. Internal conductor (current density) requirements of A.3.5.5.
c. Traceability requirements of A.3.4.6.
d. Glassivation thickness requirements of A.3.5.8.
e. Die thickness requirement of A.3.5.9.
f. Quality assurance program requirements of A.4.8.
g. Control and traceability of design documentation requirements of A.3.5.4.
h. Workmanship and rework provisions of A.3.7.
i. Design and construction baseline requirements of A.4.8.1.3.8.
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ACTEL [ Actel Corporation ]
