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OR2T26A-4BA208 参数 Datasheet PDF下载

OR2T26A-4BA208图片预览
型号: OR2T26A-4BA208
PDF下载: 下载PDF文件 查看货源
内容描述: 现场可编程门阵列 [Field-Programmable Gate Arrays]
分类和应用: 现场可编程门阵列
文件页数/大小: 192 页 / 2992 K
品牌: ETC [ ETC ]
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Data Sheet  
June 1999  
ORCA Series 2 FPGAs  
Package Parasitics (continued)  
These parameters are important in determining ground bounce noise and inductive crosstalk noise. Three capaci-  
tances in pF are listed: CM, the mutual capacitance of the lead to the nearest neighbor lead; and C1 and C2, the  
total capacitance of the lead to all other leads (all other leads are assumed to be grounded). These parameters are  
important in determining capacitive crosstalk and the capacitive loading effect of the lead.  
The parasitic values in Table 30 are for the circuit model of bond wire and package lead parasitics. If the mutual  
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be added  
to each of the C1 and C2 capacitors.  
Table 30. Series 2 Package Parasitics  
Package Type  
LSW  
LMW  
RW  
C1  
C2  
CM  
LSL  
LML  
84-Pin PLCC  
3
3
3
4
4
4
4
4
5
5
5
5
4
1
1
140  
150  
140  
180  
200  
200  
200  
200  
220  
220  
220  
220  
500  
1
0.5  
1
1
0.5  
1
0.5  
0.4  
0.6  
1
7—11  
4—6  
3—6  
2—3  
100-Pin TQFP  
144-Pin TQFP  
160-Pin QFP  
1
4—6  
2—2.5  
6—8  
1.5  
2
1.5  
1
1.5  
1
10—13  
7—10  
6—9  
208-Pin SQFP  
208-Pin SQFP2  
240-Pin SQFP  
240-Pin SQFP2  
256-Pin PBGA  
304-Pin SQFP  
304-Pin SQFP2  
352-Pin PBGA  
432-Pin EBGA  
1
4—6  
2
1
1
1
4—6  
2
1
1
1
8—12  
7—11  
5—8  
5—8  
2
1
1
1
4—7  
2
1
1
1
2—4  
2
1
1
1
12—18  
11—17  
7—12  
3—5.5  
7—12  
7—12  
3—6  
2
1
1
1
2
1.5  
1
1.5  
1
1.5  
0.3  
1.5  
0.5—1  
CIRCUIT  
BOARD PAD  
LW  
RW  
LL  
PAD N  
C1  
C2  
LMW  
LML  
CM  
PAD N + 1  
LW  
RW  
LL  
C1  
C2  
5-3862(F).r2  
Figure 53. Package Parasitics  
128  
Lucent Technologies Inc.  
 
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