Proprietary TranSwitch Corporation Information for use Solely by its Customers
L3M
TXC-03452B
DATA SHEET
E
Bottom View
-E1-
E2
16
15
TRANSWITCH
14
13
12
11
10
9
TXC-03452CIOG
Note 2
-D1-
D D2
8
7
E1/4
6
5
4
3
D1/4
2
1
A
T
R
P
N
M L K J H G F E D C B
A2
A
e
b
(A3)
A1
Dimension (Note 1)
Min
Max
Notes:
A
A1
A2
1.35
0.30
0.75
1.75
0.50
0.85
1. All dimensions are in millimeters. Values shown are for
reference only.
2. Identification of the solder ball A1 corner is contained
within this shaded zone. This package corner may be
a 90° angle, or chamfered for A1 identification.
3. Size of array: 16 x 16, JEDEC code MO-151-AAF-1
A3 (Ref.)
0.36
b
D
0.40
0.60
17.00
15.00
D1 (BSC)
D2
15.00
15.00
15.70
15.70
E
17.00
15.00
E1 (BSC)
E2
e (BSC)
1.00
Figure 38. L3M TXC-03452B 208-Lead Small Outline Plastic Ball Grid Array Package
TXC-03452B-MB
Ed. 6, April 2001
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