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XCV200E-6FGG456I 参数 Datasheet PDF下载

XCV200E-6FGG456I图片预览
型号: XCV200E-6FGG456I
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456]
分类和应用: 时钟可编程逻辑
文件页数/大小: 99 页 / 927 K
品牌: XILINX [ XILINX, INC ]
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R
Spartan-II FPGA Family: Functional Description  
property. This property could have one of the following  
seven values.  
Transmission line effects, or reflections, typically start at  
1.5" for fast (1.5 ns) rise and fall times. Poor (or  
non-existent) termination or changes in the transmission  
line impedance cause these reflections and can cause  
additional delay in longer traces. As system speeds  
continue to increase, the effect of I/O delays can become a  
limiting factor and therefore transmission line termination  
becomes increasingly more important.  
DRIVE=2  
DRIVE=4  
DRIVE=6  
DRIVE=8  
DRIVE=12 (Default)  
DRIVE=16  
DRIVE=24  
Termination Techniques  
A variety of termination techniques reduce the impact of  
transmission line effects.  
The following lists output termination techniques:  
Design Considerations  
None  
Reference Voltage (V  
) Pins  
Series  
REF  
Parallel (Shunt)  
Series and Parallel (Series-Shunt)  
Low-voltage I/O standards with a differential amplifier input  
buffer require an input reference voltage (VREF). Provide  
the VREF as an external signal to the device.  
Input termination techniques include the following:  
The voltage reference signal is "banked" within the device  
on a half-edge basis such that for all packages there are  
eight independent VREF banks internally. See Figure 36,  
page 39 for a representation of the I/O banks. Within each  
bank approximately one of every six I/O pins is  
None  
Parallel (Shunt)  
These termination techniques can be applied in any  
combination. A generic example of each combination of  
termination methods appears in Figure 41.  
automatically configured as a VREF input.  
Within each VREF bank, any input buffers that require a  
VREF signal must be of the same type. Output buffers of any  
type and input buffers can be placed without requiring a  
reference voltage within the same VREF bank.  
Unterminated  
Double Parallel Terminated  
V
V
TT  
TT  
Z=50  
Z=50  
V
REF  
Output Drive Source Voltage (V  
) Pins  
CCO  
Unterminated Output Driving  
a Parallel Terminated Input  
Series Terminated Output Driving  
a Parallel Terminated Input  
Many of the low voltage I/O standards supported by  
Versatile I/Os require a different output drive source voltage  
(VCCO). As a result each device can often have to support  
multiple output drive source voltages.  
V
V
TT  
TT  
Z=50  
Z=50  
V
V
REF  
REF  
The VCCO supplies are internally tied together for some  
packages. The VQ100 and the PQ208 provide one  
combined VCCO supply. The TQ144 and the CS144  
packages provide four independent VCCO supplies. The  
FG256 and the FG456 provide eight independent VCCO  
supplies.  
Series-Parallel Terminated Output  
Driving a Parallel Terminated Input  
Series Terminated Output  
V
V
TT  
TT  
Z=50  
Z=50  
V
V
REF  
REF  
DS001_41_032300  
Output buffers within a given VCCO bank must share the  
same output drive source voltage. Input buffers for LVTTL,  
LVCMOS2, PCI33_3, and PCI 66_3 use the VCCO voltage  
for Input VCCO voltage.  
Figure 41: Overview of Standard Input and Output  
Termination Methods  
Simultaneous Switching Guidelines  
Transmission Line Effects  
Ground bounce can occur with high-speed digital ICs when  
multiple outputs change states simultaneously, causing  
undesired transient behavior on an output, or in the internal  
logic. This problem is also referred to as the Simultaneous  
Switching Output (SSO) problem.  
The delay of an electrical signal along a wire is dominated  
by the rise and fall times when the signal travels a short  
distance. Transmission line delays vary with inductance  
and capacitance, but a well-designed board can experience  
delays of approximately 180 ps per inch.  
Ground bounce is primarily due to current changes in the  
combined inductance of ground pins, bond wires, and  
DS001-2 (v2.8) June 13, 2008  
Product Specification  
www.xilinx.com  
Module 2 of 4  
42  
 
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