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XC3S500E-4FTG256CS1 参数 Datasheet PDF下载

XC3S500E-4FTG256CS1图片预览
型号: XC3S500E-4FTG256CS1
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 572MHz, 10476-Cell, CMOS, PBGA256,]
分类和应用: 时钟可编程逻辑
文件页数/大小: 227 页 / 6528 K
品牌: XILINX [ XILINX, INC ]
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Spartan-3E FPGA Family: Functional Description  
Table 7: Differential IOSTANDARD Bank Compatibility  
VCCO Supply  
Input  
Differential  
IOSTANDARD  
Differential Bank  
Requirements:  
Restriction(1)  
1.8V  
2.5V  
3.3V  
VREF  
Input,  
On-chip Differential Termination,  
Output  
Applies to Outputs  
LVDS_25  
Input  
Input  
Only  
Input,  
On-chip Differential Termination,  
Output  
Applies to Outputs  
RSDS_25  
Input  
Input  
Input  
Only  
Input,  
On-chip Differential Termination,  
Output  
Applies to Outputs  
MINI_LVDS_25  
Input  
Only  
LVPECL_25  
BLVDS_25  
Input  
Input  
Input  
Input  
VREF is not used for  
these I/O standards  
Input,  
Output  
Input  
Input,  
Output  
NoDifferentialBank  
Input  
DIFF_HSTL_I_18  
DIFF_HSTL_III_18  
DIFF_SSTL18_I  
Input  
Input  
Input  
Restriction  
(other I/O bank  
restrictions might  
Input,  
Output  
Input  
apply)  
Input,  
Output  
Input  
Input,  
Output  
DIFF_SSTL2_I  
Input  
Input  
Notes:  
1. Each bank can support any two of the following: LVDS_25 outputs, MINI_LVDS_25 outputs, RSDS_25 outputs.  
HSTL and SSTL inputs use the Reference Voltage (V  
bias the input-switching threshold. Once a configuration  
) to  
On-Chip Differential Termination  
REF  
Spartan-3E devices provide an on-chip ~120Ω differential  
termination across the input differential receiver terminals.  
The on-chip input differential termination in Spartan-3E  
devices potentially eliminates the external 100Ω termination  
resistor commonly found in differential receiver circuits.  
Differential termination is used for LVDS, mini-LVDS, and  
RSDS as applications permit.  
data file is loaded into the FPGA that calls for the I/Os of a  
given bank to use HSTL/SSTL, a few specifically reserved  
I/O pins on the same bank automatically convert to V  
REF  
inputs. For banks that do not contain HSTL or SSTL, V  
pins remain available for user I/Os or input pins.  
REF  
Differential standards employ a pair of signals, one the  
opposite polarity of the other. The noise canceling  
properties (for example, Common-Mode Rejection) of these  
standards permit exceptionally high data transfer rates. This  
subsection introduces the differential signaling capabilities  
of Spartan-3E devices.  
On-chip Differential Termination is available in banks with  
V
= 2.5V and is not supported on dedicated input pins.  
CCO  
Set the DIFF_TERM attribute to TRUE to enable Differential  
Termination on a differential I/O pin pair.  
The DIFF_TERM attribute uses the following syntax in the  
UCF file:  
Each device-package combination designates specific I/O  
pairs specially optimized to support differential standards. A  
unique L-number, part of the pin name, identifies the  
line-pairs associated with each bank (see Module 4, Pinout  
Descriptions). For each pair, the letters P and N designate  
the true and inverted lines, respectively. For example, the  
pin names IO_L43P_3 and IO_L43N_3 indicate the true  
and inverted lines comprising the line pair L43 on Bank 3.  
INST <I/O_BUFFER_INSTANTIATION_NAME>  
DIFF_TERM = "<TRUE/FALSE>";  
V
provides current to the outputs and additionally  
CCO  
powers the On-Chip Differential Termination. V  
must be  
CCO  
2.5V when using the On-Chip Differential Termination. The  
lines are not required for differential operation.  
V
REF  
To further understand how to combine multiple  
IOSTANDARDs within a bank, refer to IOBs Organized into  
Banks, page 19.  
DS312 (v4.2) December 14, 2018  
www.xilinx.com  
Product Specification  
17  
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