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XC3S500E-4FTG256CS1 参数 Datasheet PDF下载

XC3S500E-4FTG256CS1图片预览
型号: XC3S500E-4FTG256CS1
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 572MHz, 10476-Cell, CMOS, PBGA256,]
分类和应用: 时钟可编程逻辑
文件页数/大小: 227 页 / 6528 K
品牌: XILINX [ XILINX, INC ]
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Spartan-3E FPGA Family: Functional Description  
1. All V  
pins must be connected within a bank.  
IOBs Organized into Banks  
REF  
REF  
2. All V  
lines associated with the bank must be set to  
The Spartan-3E architecture organizes IOBs into four I/O  
banks as shown in Figure 13. Each bank maintains  
the same voltage level.  
3. The V  
levels used by all standards assigned to the  
separate V  
and V  
supplies. The separate supplies  
REF  
CCO  
REF  
Inputs of the bank must agree. The Xilinx development  
software checks for this. Table 6 describes how different  
standards use the V  
allow each bank to independently set V  
. Similarly, the  
CCO  
V
supplies can be set for each bank. Refer to Table 6  
REF  
supply.  
and Table 7 for V  
and V  
requirements.  
REF  
CCO  
REF  
If V  
is not required to bias the input switching thresholds,  
When working with Spartan-3E devices, most of the  
differential I/O standards are compatible and can be  
combined within any given bank. Each bank can support  
any two of the following differential standards: LVDS_25  
outputs, MINI_LVDS_25 outputs, and RSDS_25 outputs. As  
an example, LVDS_25 outputs, RSDS_25 outputs, and any  
other differential inputs while using on-chip differential  
termination are a valid combination. A combination not  
allowed is a single bank with LVDS_25 outputs, RSDS_25  
outputs, and MINI_LVDS_25 outputs.  
REF  
all associated V  
user I/Os or input pins.  
pins within the bank can be used as  
REF  
Package Footprint Compatibility  
Sometimes, applications outgrow the logic capacity of a  
specific Spartan-3E FPGA. Fortunately, the Spartan-3E  
family is designed so that multiple part types are available in  
pin-compatible package footprints, as described in  
Module 4, Pinout Descriptions. In some cases, there are  
subtle differences between devices available in the same  
footprint. These differences are outlined for each package,  
such as pins that are unconnected on one device but  
connected on another in the same package or pins that are  
dedicated inputs on one package but full I/O on another.  
When designing the printed circuit board (PCB), plan for  
potential future upgrades and package migration.  
X-Ref Target - Figure 13  
Bank 0  
The Spartan-3E family is not pin-compatible with any  
previous Xilinx FPGA family.  
Bank 2  
Dedicated Inputs  
DS312-2_26_021205  
Dedicated Inputs are IOBs used only as inputs. Pin names  
designate a Dedicated Input if the name starts with IP, for  
example, IP or IP_Lxxx_x. Dedicated inputs retain the full  
functionality of the IOB for input functions with a single  
exception for differential inputs (IP_Lxxx_x). For the  
differential Dedicated Inputs, the on-chip differential  
termination is not available. To replace the on-chip  
differential termination, choose a differential pair that  
supports outputs (IO_Lxxx_x) or use an external 100Ω  
termination resistor on the board.  
Figure 13: Spartan-3E I/O Banks (top view)  
I/O Banking Rules  
When assigning I/Os to banks, these V  
followed:  
rules must be  
CCO  
1. All V  
pins on the FPGA must be connected even if a  
CCO  
bank is unused.  
2. All V  
lines associated within a bank must be set to  
CCO  
the same voltage level.  
ESD Protection  
3. The V  
levels used by all standards assigned to the  
CCO  
I/Os of any given bank must agree. The Xilinx  
Clamp diodes protect all device pads against damage from  
Electro-Static Discharge (ESD) as well as excessive voltage  
transients. Each I/O has two clamp diodes: one diode  
development software checks for this. Table 6 and  
Table 7 describe how different standards use the V  
supply.  
CCO  
extends P-to-N from the pad to V  
and a second diode  
CCO  
4. If a bank does not have any V  
requirements,  
CCO  
extends N-to-P from the pad to GND. During operation,  
these diodes are normally biased in the off state. These  
clamp diodes are always connected to the pad, regardless  
of the signal standard selected. The presence of diodes  
limits the ability of Spartan-3E I/Os to tolerate high signal  
connect V  
to an available voltage, such as 2.5V or  
CCO  
3.3V. Some configuration modes might place additional  
requirements. Refer to Configuration for more  
V
CCO  
information.  
voltages. The V absolute maximum rating in Table 73 of  
Module 3, DC and Switching Characteristics specifies the  
voltage range that I/Os can tolerate.  
IN  
If any of the standards assigned to the Inputs of the bank  
use V  
, then the following additional rules must be  
REF  
observed:  
DS312 (v4.2) December 14, 2018  
www.xilinx.com  
Product Specification  
19  
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