Spartan-3E FPGA Family: Pinout Descriptions
Package Overview
Table 125 shows the eight low-cost, space-saving
production package styles for the Spartan-3E family. Each
package style is available as a standard and an
environmentally friendly lead-free (Pb-free) option. The
Pb-free packages include an extra ‘G’ in the package style
name. For example, the standard “VQ100” package
becomes “VQG100” when ordered as the Pb-free option.
The mechanical dimensions of the standard and Pb-free
packages are similar. Package drawings and package
material declaration data sheets (MDDS) are available on
www.xilinx.com.
Not all Spartan-3E densities are available in all packages.
For a specific package, however, there is a common
footprint that supports all the devices available in that
package. See the footprint diagrams that follow.
For additional package information, see UG112: Device
Package User Guide.
(1)
Table 125: Spartan-3E Family Package Options
Lead
Pitch
(mm)
Maximum
I/O
Footprint
Area (mm)
Height
(mm)
Package
Leads
Type
VQ100 / VQG100
CP132 / CPG132
TQ144 / TQG144
PQ208 / PQG208
FT256 / FTG256
FG320 / FGG320
FG400 / FGG400
FG484 / FGG484
100
132
144
208
256
320
400
484
Very-thin Quad Flat Pack (VQFP)
Chip-Scale Package (CSP)
66
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
16 x 16
8.1 x 8.1
22 x 22
1.20
1.10
1.60
4.10
1.55
2.00
2.43
2.60
92
Thin Quad Flat Pack (TQFP)
108
158
190
250
304
376
Plastic Quad Flat Pack (PQFP)
Fine-pitch, Thin Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
30.6 x 30.6
17 x 17
19 x 19
21 x 21
23 x 23
Notes:
1. See the package material declaration data sheet for package mass.
packages are superior in almost every other aspect, as
summarized in Table 126. Consequently, Xilinx
recommends using BGA packaging whenever possible.
Selecting the Right Package Option
Spartan-3E FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 126: QFP and BGA Comparison
Characteristic
Quad Flat Pack (QFP)
Ball Grid Array (BGA)
Maximum User I/O
158
Good
Fair
376
Better
Better
Better
Better
4-6
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Fair
Fair
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
4
Possible
Difficult
DS312 (v4.2) December 14, 2018
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Product Specification
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