R
Platform Flash In-System Programmable Configuration PROMs
Figure 14 through Figure 16 illustrate the part markings for each available package.
Note: Package types can differ from the samples shown.
X-Ref Target - Figure 14
Package Type
Device Number
XCF04S™ VG
XX YWW
XXX
Date Code
(YWW = 200Y
workweek #WW)
Xilinx Logo
Traceability Code
TSSOP Pin 1
DS123_30_030908
Figure 14: 20-Pin TSSOP Marking
X-Ref Target - Figure 15
TSOP Pin 1
Xilinx Logo
Device Number
Fab Code
Package Type
XCF32P™ VOG48
XXX
Traceability Code
XXXXX XX
Date Code
(YWW= 200Y
workweek #WW)
DS123_31_050610
Country of Origin
XXX
XX
YWW
Figure 15: 48-Pin TSOP Marking
XCF32P™ FG48
X-Ref Target
-
Figure 16
Device Number
Package Type
Xilinx Logo
XXX
Fab Code
Traceability Code
XXXXX XX
Date Code
(YWW= 200Y
workweek #WW)
Country of Origin
XXX
XX
YWW
DS123_32_050610
TFBGA Ball A1
Figure 16: 48-Pin TFBGA Marking
Note: In Figure 15 and Figure 16, the two-digit traceability code on the bottom line between the country of origin and date code is not
present on all devices.
DS123 (v2.18) May 19, 2010
www.xilinx.com
Product Specification
31
XILINX [ XILINX, INC ]
