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W3H64M72E-ESC 参数 Datasheet PDF下载

W3H64M72E-ESC图片预览
型号: W3H64M72E-ESC
PDF下载: 下载PDF文件 查看货源
内容描述: 64M X 72 DDR2 SDRAM 208 PBGA多芯片封装 [64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package]
分类和应用: 存储内存集成电路动态存储器双倍数据速率
文件页数/大小: 30 页 / 942 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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W3H64M72E-XSBX  
White Electronic Designs  
ADVANCED*  
PRECHARGE COMMAND  
ꢀhe PRECHARGE command, illustrated in Figure 13, is  
used to deactivate the open row in a particular bank or  
the open row in all banks. ꢀhe bank(s) will be available  
for a subsequent row activation a specified time (tRP)  
after the PRECHARGE command is issued, except in  
the case of concurrent auto precharge, where a READ or  
WRIꢀE command to a different bank is allowed as long  
as it does not interrupt the data transfer in the current  
bank and does not violate any other timing parameters.  
Once a bank has been precharged, it is in the idle state  
and must be activated prior to any READ or WRIꢀE  
commands being issued to that bank. A PRECHARGE  
command is allowed if there is no open row in that bank  
(idle state) or if the previously open row is already in the  
process of precharging. However, the precharge period  
will be determined by the last PRECHARGE command  
issued to the bank.  
FIGURE 13 – PRECHARGE COMMAND  
CK#  
CK  
CKE  
HIGH  
CS#  
RAS#  
CAS#  
WE#  
PRECHARGE OPERATION  
ADDRESS  
Input A10 determines whether one or all banks are to be  
precharged, and in the case where only one bank is to be  
precharged, inputs BA2–BA0 select the bank. Otherwise  
BA2–BA0 are treated as “Don’t Care.”  
ATT BANKS  
A10  
ONE BANK  
BA0 - BA2  
BA  
When all banks are to be precharged, inputs BA2–BA0  
are treated as “Don’t Care.” Once a bank has been  
precharged, it is in the idle state and must be activated prior  
to any READ or WRIꢀE commands being issued to that  
bank. tRPA timing applies when the PRECHARGE (ATT)  
command is issued, regardless of the number of banks  
already open or closed. If a single-bank PRECHARGE  
command is issued, tRP timing applies. tRPA(MIN) applies  
to all 8-bank DDR2 devices.  
DON’ꢀ CARE  
Note: BA = bank address (if A10 is LOW; otherwise "Don't Care").  
cycles must then occur before a READ command can be  
issued). ꢀhe differential clock should remain stable and  
meet CKE specifications at least 1 x CK after entering  
self refresh mode. All command and address input signals  
except CKE are “Don’t Care” during self refresh.  
t
t
SELF REFRESH COMMAND  
ꢀhe procedure for exiting self refresh requires a sequence  
of commands. First, the differential clock must be stable  
and meet tCK specifications at least 1 x tCK prior to CKE  
going back HIGH. Once CKE is HIGH (tCTE(MIN) has  
been satisfied with four clock registrations), the DDR2  
SDRAM must have NOP or DESETECꢀ commands issued  
for tXSNR because time is required for the completion of  
any internal refresh in progress. A simple algorithm for  
meeting both refresh and DTT requirements is to apply  
NOP or DESETECꢀ commands for 200 clock cycles before  
applying any other command.  
ꢀhe SETF REFRESH command can be used to retain  
data in the DDR2 SDRAM, even if the rest of the system  
is powered down. When in the self refresh mode, the  
DDR2 SDRAM retains data without external clocking. All  
power supply inputs (including VREF) must be maintained  
at valid levels upon entry/exit and during SETF REFRESH  
operation.  
ꢀhe SETF REFRESH command is initiated like a  
REFRESH command except CKE is TOW. ꢀhe DTT is  
automatically disabled upon entering self refresh and is  
automatically enabled upon exiting self refresh (200 clock  
Note: Self refresh not available at military temperature..  
White Electronic Designs Corp. reserves the right to change products or specifications without notice.  
March 2006  
Rev. 1  
21  
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
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