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W3H64M72E-ESC 参数 Datasheet PDF下载

W3H64M72E-ESC图片预览
型号: W3H64M72E-ESC
PDF下载: 下载PDF文件 查看货源
内容描述: 64M X 72 DDR2 SDRAM 208 PBGA多芯片封装 [64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package]
分类和应用: 存储内存集成电路动态存储器双倍数据速率
文件页数/大小: 30 页 / 942 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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W3H64M72E-XSBX  
White Electronic Designs  
ADVANCED*  
DESELECT  
ꢀhe DESETECꢀ function (CS# HIGH) prevents new  
commands from being executed by the DDR2 SDRAM.  
ꢀhe DDR2 SDRAM is effectively deselected. Operations  
already in progress are not affected.  
entered. ꢀhe same procedure is used to convert other  
specification limits from time units to clock cycles. For  
t
example, a RCD (MIN) specification of 20ns with a 266  
MHz clock (tCK = 3.75ns) results in 5.3 clocks, rounded  
up to 6.  
NO OPERATION (NOP)  
A subsequent ACꢀIVE command to a different row in the  
same bank can only be issued after the previous active  
row has been closed (precharged). ꢀhe minimum time  
interval between successive ACꢀIVE commands to the  
same bank is defined by tRC  
ꢀhe NO OPERAꢀION (NOP) command is used to instruct  
the selected DDR2 SDRAM to perform a NOP (CS# is  
TOW; RAS#, CAS#, and WE are HIGH). ꢀhis prevents  
unwanted commands from being registered during idle  
or wait states. Operations already in progress are not  
affected.  
A subsequent ACꢀIVE command to another bank can be  
issued while the first bank is being accessed, which results  
in a reduction of total row-access overhead. ꢀhe minimum  
time interval between successive ACꢀIVE commands to  
different banks is defined by tRRD  
LOAD MODE (LM)  
ꢀhe mode registers are loaded via inputs BA2–BA0, and  
A12–A0. BA2–BA0 determine which mode register will  
be programmed. See “Mode Register (MR)”. ꢀhe TM  
command can only be issued when all banks are idle, and  
a subsequent execute able command cannot be issued  
until tMRD is met.  
FIGURE 10 – ACTIVE COMMAND  
BANK/ROW ACTIVATION  
ACTIVE COMMAND  
CK#  
CK  
ꢀhe ACꢀIVE command is used to open (or activate) a  
row in a particular bank for a subsequent access. ꢀhe  
value on the BA2–BA0 inputs selects the bank, and the  
address provided on inputs A12–A0 selects the row.  
ꢀhis row remains active (or open) for accesses until  
a PRECHARGE command is issued to that bank. A  
PRECHARGE command must be issued before opening  
a different row in the same bank.  
CKE  
CS#  
RAS#  
CAS#  
WE#  
ACTIVE OPERATION  
Before any READ or WRIꢀE commands can be issued to  
a bank within the DDR2 SDRAM, a row in that bank must  
be opened (activated), even when additive latency is used.  
ꢀhis is accomplished via the ACꢀIVE command, which  
selects both the bank and the row to be activated.  
Row  
ADDRESS  
BANK ADDRESS  
Bank  
After a row is opened with an ACꢀIVE command, a READ  
or WRIꢀE command may be issued to that row, subject to  
the tRCD specification. tRCD (MIN) should be divided by  
the clock period and rounded up to the next whole number  
to determine the earliest clock edge after the ACꢀIVE  
command on which a READ or WRIꢀE command can be  
DON’ꢀ CARE  
White Electronic Designs Corp. reserves the right to change products or specifications without notice.  
March 2006  
Rev. 1  
17  
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
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