VSC7961
Data Sheet
BARE DICE AND PACKAGE INFORMATION
1597µm (0.06287")
Pad1
CAZ1
Pad 16
NC
Pad 2
CAZ2
Pad 15
SQ
Pad 3
GND
Pad 14
VCC
Pad 4
LAINP
Pad 13
LAOP
VSC7961
Top View
1597µm
(0.06287")
Pad 5
LAINM
Pad 12
LAOM
Pad 6
GND
Pad 11
VCC
Pad 7
NC
Pad 10
LOS
Pad 8
TH
Pad 9
LOS
Die Size Including Scribe:
Die Size Not Including Scribe: 1440µm x 1440µm (0.0567 x 0.0567")
Pad Pitch:
1597µm x 1597µm (0.0629" x 0.0629")
180µm (0.0071")
Pad Passivation Opening:
Die Thickness:
95µm x 95µm (0.0037" x 0.0037")
280µm (0.011")
The back side of the die may either be left floating or connected
to the most negative potential.
Figure 2. Pad Diagram for Bare Die (-W)
8 of 14
G52360, Rev 4.0
5/15/03
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
