UCC27523, UCC27524, UCC27525, UCC27526
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SLUSAQ3F –NOVEMBER 2011–REVISED MAY 2013
Thermal Information
The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal
characteristics of the device package. In order for a gate driver device to be useful over a particular temperature
range the package must allow for the efficient removal of the heat produced while keeping the junction
temperature within rated limits. The UCC27523/4/5/6 family of drivers is available in four different packages to
cover a range of application requirements. The thermal metrics for each of these packages are summarized in
the Thermal Information section of the datasheet. For detailed information regarding the thermal information
table, please refer to Application Note from Texas Instruments entitled, IC Package Thermal Metrics (SPRA953).
Among the different package options available in the UCC2752x family, of particular mention are the DSD &
DGN packages when it comes to power dissipation capability. The MSOP PowerPAD-8 (DGN) package and 3-
mm × 3-mm WSON (DSD) package offer a means of removing the heat from the semiconductor junction through
the bottom of the package. Both these packages offer an exposed thermal pad at the base of the package. This
pad is soldered to the copper on the printed circuit board directly underneath the device package, reducing the
thermal resistance to a very low value. This allows a significant improvement in heat-sinking over that available in
the D or P packages. The printed circuit board must be designed with thermal lands and thermal vias to complete
the heat removal subsystem. Note that the exposed pads in the MSOP-8 (PowerPAD) and WSON-8 packages
are not directly connected to any leads of the package, however, it is electrically and thermally connected to the
substrate of the device which is the ground of the device. TI recommends to externally connect the exposed
pads to GND in PCB layout for better EMI immunity.
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