UCC27423, UCC27424, UCC27425
SLUS545D –NOVEMBER 2002–REVISED MAY 2013
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ORDERING INFORMATION
PACKAGED DEVICES
OUTPUT
CONFIGURATION
TEMPERATURE RANGE
TA = TJ
SOIC-8
(D)(1)
MSOP-8 PowerPAD
(DGN)(2)
PDIP-8
(P)
Dual inverting
–40°C to 125°C
–40°C to 125°C
UCC27423D
UCC27424D
UCC27423DGN
UCC27424DGN
UCC27423P
UCC27424P
Dual nonInverting
One inverting, one
noninverting
–40°C to 125°C
UCC27425D
UCC27425DGN
UCC27425P
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27423DR,
UCC27424DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the
substrate which is the ground of the device.
D, DGN, OR P PACKAGE
(TOP VIEW)
D, DGN, OR P PACKAGE
(TOP VIEW)
D, DGN, OR P PACKAGE
(TOP VIEW)
UCC27425
UCC27424
UCC27423
ENBA
1
8
7
6
5
ENBB
OUTA
VDD
ENBA
1
8
7
6
5
ENBB
OUTA
VDD
ENBA
1
8
7
6
5
ENBB
OUTA
VDD
INA 2
GND 3
INB 4
INA 2
GND 3
INB 4
INA 2
GND 3
INB 4
OUTB
OUTB
OUTB
(DUAL INVERTING)
(DUAL NON-INVERTING)
(ONE INVERTING AND
ONE NON-INVERTING)
POWER DISSIPATION RATING TABLE
DERATING FACTOR
POWER RATING (mW)
TA = 70°C(1)
PACKAGE
SUFFIX
θJC (°C/W)
θJA (°C/W)
ABOVE
70°C (mW/°C)(1)
SOIC-8
PDIP-8
D
P
42
49
84 - 160‡
110
344–655(2)
500
6.25–11.9(2)
9
MSOP PowerPAD-8(3)
DGN
4.7
50 - 59‡
1370
17.1
(1) 125°C operating junction temperature is used for power rating calculations
(2) The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best
and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order
to spread the heat away form the device more effectively. For information on the PowerPAD™ package, refer to Technical Brief,
PowerPad Thermally Enhanced Package, Texas Instruments (SLMA002) and Application Brief, PowerPad Made Easy, Texas
Instruments (SLMA004).
(3) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the
substrate which is the ground of the device.
Table 1. Input/Output Table
INPUTS (VIN_L, VIN_H)
UCC27423
UCC27424
UCC27425
ENBA
ENBB
INA
L
INB
L
OUTA OUTB OUTA OUTB OUTA OUTB
H
H
H
H
L
H
H
H
H
L
H
H
L
H
L
L
L
L
H
L
H
H
L
L
H
L
L
H
H
L
H
L
H
H
L
H
H
L
H
L
L
H
L
X
X
L
L
L
2
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Product Folder Links: UCC27423 UCC27424 UCC27425
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