TAS5614LA
SLAS846 –MAY 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
GENERAL INFORMATION
Terminal Assignment
The TAS5614LA is available in a thermally enhanced package:
44-Pin HTSSOP package (DDV)
•
The package contains a PowerPAD™ that is located on the top side of the device for convenient thermal
coupling to the heat sink.
44 PIN
DDV PACKAGE
(TOP VIEW)
GVDD_AB
VDD
BST_A
BST_B
GND
OC_ADJ
RESET
INPUT_A
INPUT_B
C_START
GND
OUT_A
OUT_A
PVDD_AB
PVDD_AB
PVDD_AB
OUT_B
DVDD
GND
GND
GND
GND
GND
GND
AVDD
OUT_C
PVDD_CD
PVDD_CD
INPUT_C
INPUT_D
FAULT
OTW
PVDD_CD
OUT_D
CLIP
M1
OUT_D
GND
GND
M2
M3
BST_C
BST_D
GVDD_CD
2
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Product Folder Link(s): TAS5614LA
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