SN65HVD72
SN65HVD75
SN65HVD78
SLLSE11B –MARCH 2012–REVISED JUNE 2012
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TYPICAL CHARACTERISTICS (continued)
Receiver Output
vs
Input
3.5
3
2.5
2
VIT- (-7V)
VIT-(0V)
VIT-(12V)
VIT+(-7V)
VIT+(0V)
VIT+(12V)
1.5
1
0.5
0
-150
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
Differential Input Voltage (VID) mV
Figure 17.
SPACER
DEVICE INFORMATION
Table 4. Thermal Information
PARAMETER
D
DGK
DRB
Units
SOIC-8
MSOP-8
SON-8
ΘJA
Junction-to-Ambient Thermal Resistance
Junction-to-Board Thermal Resistance
Junction-to-Case(top) Thermal Resistance
Junction-to-Case(top) Thermal Resistance
Junction-to-Top thermal parameter
110.7
51.3
54.7
n/a
168.7
89.5
62.2
n/a
40.0
15.5
49.6
3.9
°C/ W
ΘJB
ΘJC(top)
ΘJC(top)
ΨJT
9.2
7.4
0.6
ΨJB
Junction-to-Board thermal parameter
Thermal Shut-down junction temperature
50.7
87.9
170
15.7
TTSD
°C
Table 5. Power Dissipation
PARAMETER
TEST CONDITIONS
VALUE
UNITS
HVD72
HVD75
HVD78
HVD72
HVD75
HVD78
HVD72
HVD75
HVD78
120
160
200
155
195
230
190
230
260
RL = 300 Ω,
CL = 50 pF (driver)
Unterminated
RS-422 load
RS-485 load
mW
Power Dissipation
driver and receiver enabled,
VCC = 3.6 V, TJ = 150°C
50% duty cycle square-wave signal at
signaling rate:
RL = 100 Ω,
CL = 50 pF (driver)
PD
mW
mW
•
•
•
HVD72 at 250 kbps
HVD75 at 20 Mbps
HVD78 at 50 Mbps
RL = 54 Ω,
CL = 50 pF (driver),
12
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