PGA281
SBOS664A –MARCH 2013–REVISED JUNE 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
V
VSN to VSP
40
Supply voltage
VSON to VSOP, and VSON to DVDD
6
VSN – 0.5 to VSP + 0.5
±10
V
Signal input terminals, voltage(2)
Signal input terminals, current(2)
Output short-circuit(3)
V
mA
Continuous
Operating temperature
–55 to +140
–65 to +150
+150
°C
°C
°C
Storage temperature
Junction temperature
Electrostatic
discharge (ESD) Human body model (HBM)
ratings
2000
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Terminals are diode-clamped to the power-supply (VON and VOP) rails. Signals that can swing more than 0.5 V beyond the supply rails
must be current-limited.
(3) Short-circuit to VSON or VSOP, respectively, VSON or DVDD.
THERMAL INFORMATION
PGA281
THERMAL METRIC(1)
PW (TSSOP)
16 PINS
92.6
UNITS
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
23.7
37.9
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.0
ψJB
37.3
θJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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