MSP430FR573x
MSP430FR572x
SLAS639D –JULY 2011–REVISED AUGUST 2012
www.ti.com
Table 2. Ordering Information(1)
PACKAGED DEVICES(2)
PLASTIC 40-PIN
VQFN
PLASTIC 24-PIN
PLASTIC 38-PIN
PLASTIC 28-PIN
TSSOP
PLASTIC 25-BALL
DSBGA
TA
VQFN
(RGE)
TSSOP
(DA)
(RHA)
(PW)
(YFF)(3)
MSP430FR5721IRHA
MSP430FR5723IRHA
MSP430FR5725IRHA
MSP430FR5727IRHA
MSP430FR5729IRHA
MSP430FR5731IRHA
MSP430FR5733IRHA
MSP430FR5735IRHA
MSP430FR5737IRHA
MSP430FR5739IRHA
MSP430FR5720IRGE
MSP430FR5722IRGE
MSP430FR5724IRGE
MSP430FR5726IRGE
MSP430FR5728IRGE
MSP430FR5730IRGE
MSP430FR5732IRGE
MSP430FR5734IRGE
MSP430FR5736IRGE
MSP430FR5738IRGE
MSP430FR5721IDA
MSP430FR5723IDA
MSP430FR5725IDA
MSP430FR5727IDA
MSP430FR5729IDA
MSP430FR5731IDA
MSP430FR5733IDA
MSP430FR5735IDA
MSP430FR5737IDA
MSP430FR5739IDA
MSP430FR5720IPW
MSP430FR5722IPW
MSP430FR5724IPW
MSP430FR5726IPW
MSP430FR5728IPW
MSP430FR5730IPW
MSP430FR5732IPW
MSP430FR5734IPW
MSP430FR5736IPW
MSP430FR5738IPW
MSP430FR5730IYFF(3)
MSP430FR5736IYFF(3)
MSP430FR5738IYFF(3)
–40°C to
85°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/packaging.
(3) Product Preview
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