MSP430FR5732IRGER 参数 Datasheet PDF下载

MSP430FR573x

MSP430FR572x

SLAS639D – JULY 2011 – REVISED AUGUST 2012

Table 2. Ordering Information

(1)

PACKAGED DEVICES

(2)

T

A

PLASTIC 40-PIN

VQFN

(RHA)

MSP430FR5721IRHA

MSP430FR5723IRHA

MSP430FR5725IRHA

MSP430FR5727IRHA

–40°C to

85°C

MSP430FR5729IRHA

MSP430FR5731IRHA

MSP430FR5733IRHA

MSP430FR5735IRHA

MSP430FR5737IRHA

MSP430FR5739IRHA

PLASTIC 24-PIN

VQFN

(RGE)

MSP430FR5720IRGE

MSP430FR5722IRGE

MSP430FR5724IRGE

MSP430FR5726IRGE

MSP430FR5728IRGE

MSP430FR5730IRGE

MSP430FR5732IRGE

MSP430FR5734IRGE

MSP430FR5736IRGE

MSP430FR5738IRGE

PLASTIC 38-PIN

TSSOP

(DA)

MSP430FR5721IDA

MSP430FR5723IDA

MSP430FR5725IDA

MSP430FR5727IDA

MSP430FR5729IDA

MSP430FR5731IDA

MSP430FR5733IDA

MSP430FR5735IDA

MSP430FR5737IDA

MSP430FR5739IDA

PLASTIC 28-PIN

TSSOP

(PW)

MSP430FR5720IPW

MSP430FR5722IPW

MSP430FR5724IPW

MSP430FR5726IPW

MSP430FR5728IPW

MSP430FR5730IPW

MSP430FR5732IPW

MSP430FR5734IPW

MSP430FR5736IPW

MSP430FR5738IPW

PLASTIC 25-BALL

DSBGA

(YFF)

(3)

MSP430FR5730IYFF

(3)

MSP430FR5736IYFF

(3)

MSP430FR5738IYFF

(3)

(1)

(2)

(3)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

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