LMH0324
ZHCSIC8B –APRIL 2016–REVISED JUNE 2018
www.ti.com.cn
目录
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 16
7.5 LMH0324 Register Map .......................................... 21
Application and Implementation ........................ 26
8.1 Application Information............................................ 26
8.2 Typical Application ................................................. 26
Power Supply Recommendations...................... 30
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2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
8
9
10 Layout................................................................... 31
10.1 Layout Guidelines ................................................. 31
10.2 Layout Example .................................................... 31
11 器件和文档支持 ..................................................... 32
11.1 接收文档更新通知 ................................................. 32
11.2 社区资源................................................................ 32
11.3 商标....................................................................... 32
11.4 静电放电警告......................................................... 32
11.5 术语表 ................................................................... 32
12 机械、封装和可订购信息....................................... 32
6.6 Recommended SMBus Interface AC Timing
Specifications............................................................. 9
6.7 Serial Parallel Interface (SPI) AC Timing
Specifications............................................................. 9
6.8 Typical Characteristics............................................ 10
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7
4 修订历史记录
Changes from Revision A (May 2016) to Revision B
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已添加 参考设计顶部导航图标链接；首次公开发布的产品说明书 ......................................................................................... 1
Changes from Original (April 2016) to Revision A
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Deleted min and max VOD_DE amplitude specification when VOD_DE = Level F ............................................................. 8
Changed typical VOD_DE amplitude specifications for Levels F, R, and L .......................................................................... 8
Changed DEM value and DEM register settings in Table 4 to match correct VOD_DE pin logic levels ............................. 14
已添加 new row for VOD = 5, DEM = 5 setting in 表 9 ....................................................................................................... 28
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