欢迎访问ic37.com |
会员登录 免费注册
发布采购

DP83840AVCE 参数 Datasheet PDF下载

DP83840AVCE图片预览
型号: DP83840AVCE
PDF下载: 下载PDF文件 查看货源
内容描述: 10/100 Mb / s的以太网物理层 [10/100 Mb/s Ethernet Physical Layer]
分类和应用: 电信集成电路电信电路信息通信管理以太网局域网(LAN)标准
文件页数/大小: 91 页 / 682 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号DP83840AVCE的Datasheet PDF文件第31页浏览型号DP83840AVCE的Datasheet PDF文件第32页浏览型号DP83840AVCE的Datasheet PDF文件第33页浏览型号DP83840AVCE的Datasheet PDF文件第34页浏览型号DP83840AVCE的Datasheet PDF文件第36页浏览型号DP83840AVCE的Datasheet PDF文件第37页浏览型号DP83840AVCE的Datasheet PDF文件第38页浏览型号DP83840AVCE的Datasheet PDF文件第39页  
3.0 Functional Description (Continued)  
product. The IEEE 1149.1 Boundary Scan Architecture are connected to system output pins. This ensures that  
document should be referenced for additional detail.  
known data is driven through the system output pins upon  
entering the Extest instruction.  
The circuitry defined by this standard allows test  
instructions and associated data to be input serially into a Without Preload, indeterminate data would be driven until  
device. The instruction execution results are output serially. the first scan sequence has been completed. The shifting  
of data for the Sample and Preload phases can occur  
The DP83840A reserves five pins, called the Test Access  
simultaneously. While data capture is being shifted out, the  
Port (TAP), to provide test access: TMS, TCK, Test Data  
preload data can be shifted in.  
Input (TDI), Test Data Output (TDO) and Test Reset  
(TRST). These signals are described in Section 2.7. To 3.8.1.4 Extest Instruction  
ensure race-free operation all input and output data is  
The Extest instruction allows circuitry external to the  
synchronous to the test clock (TCK). TAP input signals  
DP83840A (typically the board interconnections) to be  
(TMS and TDI) are clocked into the test logic on the rising  
tested.  
edge of TCK while output signal (TDO) is clocked on the  
falling edge.  
Prior to executing the Extest instruction, the first test  
stimulus to be applied will be shifted into the boundary-  
scan registers using the Sample/Preload instruction. Thus,  
3.8.1 Test Logic  
The IEEE 1149.1 Test Logic consists of a Test Access Port when the change to the truction takes place,  
(TAP) controller, an instruction register, and a group of test known data will be driven ly from the DP83840A  
data registers including Bypass, Device Identification and to its external connection
Boundary Scan registers.  
This provides stis to thystem iut pins of adjacent  
The TAP controller is a synchronous 16 state machine that devices on the asbled prid cuit boards. Figure 14  
responds to changes at the TMS and TCK signals.  
below illustrates the IEE 1149.1 architecture.  
This controls the sequence of operations by generating 3.8.2 Devting  
clock and control signals to the instruction and test data  
registers. The control signals switch TDI and TDO between  
instruction and test data registers.  
IEEE 11ides a simple solution for testing many of  
the stantatic pparametrics. Reasonably accurate  
its matested a functional pattern.  
The DP83840A implements 4 basic instructions: ID_Code,  
bypass, Sample/Preload and Extest. Upon reset, the  
ID_Code instruction is selected by default. If the ID_Co
instruction is not supported, the bypass instruct
selected instead.  
The IEEE test circuitry is tested itself as a  
conseence of testing pin parametrics. Specific tests are:  
TRI-SATE conditions of TDO when serial shift  
etween TDI and TDO is not selected  
3.8.1.1 ID_Code Instruction  
put leakage of TCK, TMS, TDI and TRST  
Output has TRI-STATE leakage of TDO  
The ID_Code instruction allows users to slect the 32-
IDCODE register and interrogate the contents which  
consist of the manufacturer's ID, part Iand veion  
number.  
Opens and shorts of TCK, TMS, TDI, TRST, and TDO  
IDCODE register, the bypass register and the TAP  
controller state machine sequences  
3.8.1.2 Bypass Instrucon  
Open and shorted pins can be identified by placing an  
alternating bit pattern  
The bypass instruction us register. The  
bypass register contains a sinr stage and is  
used to provide um lengh between the  
TDI and TD83840test operation is  
not requirerapid ovement of test data  
to and froes in the system.  
on the I/O pins. Any shorted bond wires would either cause  
an input to be misinterpreted in the inputs scan phase, or  
the test comparator would fail an output during data scan.  
Repeating the test with the inverse bit pattern provides  
coverage of VCC and GND short/open circuits.  
3.8.1.3 Saction  
The Sampleion allows scanning of the  
boundary-scan out causing interference to the  
normal operation of the on-chip system logic.  
3.8.3 Boundary Scan Description Language File  
A Boundary Scan Description Language (BSDL) file is  
available. Contact your local National Semiconductor  
representative to obtain the latest version.  
Two functions are performed when this instruction is  
selected.  
Sample allows a snapshot to be taken of the data flowing  
from the system pins to the on-chip test logic or vice versa,  
without interfering with normal operation. The snapshot is  
taken on the rising edge of TCK in the Capture-DR  
controller state, and the data can be viewed by shifting  
through the component's TDO output.  
While sampling and shifting data out through TDO for  
observation, preload allows an initial data pattern to be  
shifted in through TDI and to be placed at the latched  
parallel output of the boundary-scan register cells which  
Version A  
National Semiconductor  
34  
 复制成功!