欢迎访问ic37.com |
会员登录 免费注册
发布采购

DLPA2000DYFFR 参数 Datasheet PDF下载

DLPA2000DYFFR图片预览
型号: DLPA2000DYFFR
PDF下载: 下载PDF文件 查看货源
内容描述: [DLP® PMIC/LED driver for DLP2010 (0.2 WVGA) DMD | YFF | 56 | -10 to 85]
分类和应用: 集成电源管理电路
文件页数/大小: 58 页 / 1911 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号DLPA2000DYFFR的Datasheet PDF文件第1页浏览型号DLPA2000DYFFR的Datasheet PDF文件第3页浏览型号DLPA2000DYFFR的Datasheet PDF文件第4页浏览型号DLPA2000DYFFR的Datasheet PDF文件第5页浏览型号DLPA2000DYFFR的Datasheet PDF文件第6页浏览型号DLPA2000DYFFR的Datasheet PDF文件第7页浏览型号DLPA2000DYFFR的Datasheet PDF文件第8页浏览型号DLPA2000DYFFR的Datasheet PDF文件第9页  
DLPA2000  
ZHCSCO5B JUNE 2014REVISED FEBRUARY 2018  
www.ti.com.cn  
目录  
7.4 Device Functional Modes........................................ 27  
7.5 Register Maps......................................................... 29  
Application and Implementation ........................ 41  
8.1 Application Information............................................ 41  
8.2 Typical Projector Application .................................. 41  
8.3 Typical Mobile Sensing Application ....................... 43  
Power Supply Recommendations...................... 46  
1
2
3
4
5
6
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 5  
6.1 Absolute Maximum Ratings ...................................... 5  
6.2 Storage Conditions.................................................... 5  
6.3 ESD Ratings.............................................................. 5  
6.4 Recommended Operating Conditions....................... 5  
6.5 Thermal Information.................................................. 6  
6.6 Electrical Characteristics........................................... 6  
6.7 Motor Driver Timing Requirements......................... 11  
6.8 Data Transmission Timing Requirements............... 12  
6.9 Typical Characteristics............................................ 13  
Detailed Description ............................................ 14  
7.1 Overview ................................................................. 14  
7.2 Functional Block Diagram ....................................... 15  
7.3 Feature Description................................................. 16  
8
9
10 Layout................................................................... 47  
10.1 Layout Guidelines ................................................. 47  
10.2 Layout Example .................................................... 48  
11 器件和文档支持 ..................................................... 49  
11.1 器件支持 ............................................................... 49  
11.2 相关链接................................................................ 49  
11.3 社区资源................................................................ 49  
11.4 ....................................................................... 49  
11.5 静电放电警告......................................................... 49  
11.6 Glossary................................................................ 50  
12 机械、封装和可订购信息....................................... 51  
7
4 修订历史记录  
Changes from Revision A (August 2015) to Revision B  
Page  
修正了器件信息中的封装尺寸的拼写错误,将 3.48mm2 更正为 3.48mm............................................................................... 1  
已添加 在修订版本 A 中添加先前缺失的历史记录标........................................................................................................... 1  
Corrected package family to 'DSBGA' in Pin Functions Diagram, originally labeled as 'DSGBA' ......................................... 3  
Added mechanical package designator YFF to Thermal Information .................................................................................... 6  
Changed layout example to show correct image in Figure 46 ............................................................................................. 48  
Changes from Original (June 2014) to Revision A  
Page  
已更改 将最大电流更改为 750mA........................................................................................................................................... 1  
已添加 移动传感应用 .............................................................................................................................................................. 1  
Added typical Mobile sensing application ............................................................................................................................ 43  
Updated the Power Supply Recommendations to remove information that did not apply to the DLPA2000 ..................... 46  
2
Copyright © 2014–2018, Texas Instruments Incorporated  
 
 复制成功!