DLPA2000
ZHCSCO5B –JUNE 2014–REVISED FEBRUARY 2018
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 27
7.5 Register Maps......................................................... 29
Application and Implementation ........................ 41
8.1 Application Information............................................ 41
8.2 Typical Projector Application .................................. 41
8.3 Typical Mobile Sensing Application ....................... 43
Power Supply Recommendations...................... 46
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特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 Storage Conditions.................................................... 5
6.3 ESD Ratings.............................................................. 5
6.4 Recommended Operating Conditions....................... 5
6.5 Thermal Information.................................................. 6
6.6 Electrical Characteristics........................................... 6
6.7 Motor Driver Timing Requirements......................... 11
6.8 Data Transmission Timing Requirements............... 12
6.9 Typical Characteristics............................................ 13
Detailed Description ............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagram ....................................... 15
7.3 Feature Description................................................. 16
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10 Layout................................................................... 47
10.1 Layout Guidelines ................................................. 47
10.2 Layout Example .................................................... 48
11 器件和文档支持 ..................................................... 49
11.1 器件支持 ............................................................... 49
11.2 相关链接................................................................ 49
11.3 社区资源................................................................ 49
11.4 商标....................................................................... 49
11.5 静电放电警告......................................................... 49
11.6 Glossary................................................................ 50
12 机械、封装和可订购信息....................................... 51
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4 修订历史记录
Changes from Revision A (August 2015) to Revision B
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修正了器件信息中的封装尺寸的拼写错误,将 3.48mm2 更正为 3.48mm............................................................................... 1
已添加 在修订版本 A 中添加先前缺失的历史记录标记........................................................................................................... 1
Corrected package family to 'DSBGA' in Pin Functions Diagram, originally labeled as 'DSGBA' ......................................... 3
Added mechanical package designator YFF to Thermal Information .................................................................................... 6
Changed layout example to show correct image in Figure 46 ............................................................................................. 48
Changes from Original (June 2014) to Revision A
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已更改 将最大电流更改为 750mA........................................................................................................................................... 1
已添加 移动传感应用 .............................................................................................................................................................. 1
Added typical Mobile sensing application ............................................................................................................................ 43
Updated the Power Supply Recommendations to remove information that did not apply to the DLPA2000 ..................... 46
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