AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717F –OCTOBER 2011–REVISED APRIL 2013
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Complete stackup specifications are provided in Table 5-46.
Table 5-46. PCB Stackup Specifications(1)
NO.
1
PARAMETER
MIN
4
TYP
MAX
UNIT
PCB routing and plane layers
Signal routing layers
2
2
3
Full ground layers under DDR2 routing region
Number of ground plane cuts allowed within DDR2 routing region
Full VDDS_DDR power reference layers under DDR2 routing region
Number of layers between DDR2 routing layer and reference ground plane
PCB routing feature size
1
4
0
0
5
1
6
7
4
4
mils
mils
mils
mils
8
PCB trace width, w
PCB BGA escape via pad size(2)
9
18
10
0.5
0.4
20
10 PCB BGA escape via hole size(2)
ZCZ package
ZCE package
11 AM335x BGA pad size
mm
13 Single-ended impedance, Zo(3)
14 Impedance control(4)(5)
50
75
ohms
ohms
Zo-5
Zo
Zo+5
(1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the
AM335x device.
(3) Zo is the nominal singled-ended impedance selected for the PCB.
(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(5) Tighter impedance control is required to ensure flight time skew is minimal.
162
Peripheral Information and Timings
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