APPENDIX A - Continued.
30.3 Algorithm C (pattern 3).
30.2.1 XY March.
Step 1. Load memory with background data, incrementing from minimum to maximum address locations (All
"0's").
Step 2. Read data in location 0.
Step 3. Write complement data to location 0.
Step 4. Read complement data in location 0.
Step 5. Repeat steps 2 through 4 incrementing Y-fast sequentially, for each location in the array.
Step 6. Read complement data in maximum address location.
Step 7. Write data to maximum address location.
Step 8. Read data in maximum address location.
Step 9. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array.
Step 10. Read data in location 0.
Step 11. Write complement data to location 0.
Step 12. Read complement data in location 0.
Step 13. Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array.
Step 14. Read complement data in maximum address location.
Step 15. Write data to maximum address location.
Step 16. Read data in maximum address location.
Step 17. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Step 18. Read background data from memory, decrementing Y-fast from maximum to minimum address locations.
30.4 Algorithm D (pattern 4).
30.4.1 CEDES - CE deselect checkerboard, checkerboard-bar.
Step 1. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Step 2. Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from
location 0 to maximum.
Step 3. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Step 4. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Step 5. Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0
to maximum.
Step 6. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to
maximum.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
44
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
