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5962-8959833MTC 参数 Datasheet PDF下载

5962-8959833MTC图片预览
型号: 5962-8959833MTC
PDF下载: 下载PDF文件 查看货源
内容描述: [Standard SRAM, 128KX8, 70ns, CMOS, CDFP32,]
分类和应用: 静态存储器
文件页数/大小: 89 页 / 343 K
品牌: TEMIC [ TEMIC SEMICONDUCTORS ]
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APPENDIX C  
FORMS A PART OF SMD 5962-89598  
10. SCOPE  
10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified  
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the  
manufacturers approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic  
modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product  
assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected  
in the Part or Identification Number (PIN). When available a choice of Radiation Hardness Assurance (RHA) levels are  
reflected in the PIN.  
10.2 PIN. The PIN is as shown in the following example:  
5962  
-
89598  
01  
V
6
A
Federal  
stock class  
designator  
\
RHA  
designator  
(see 10.2.1)  
Device  
type  
(see 10.2.2)  
Device  
class  
designator  
(see 10.2.3)  
Die  
code  
(see 10.2.4)  
Die  
Details  
(see 10.2.5)  
/
\/  
Drawing number  
10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels.  
A dash (-) indicates a non-RHA die.  
10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:  
Device type  
47  
Generic number  
65608EV-30  
Circuit function  
Access time  
30ns  
128K X 8 very low power CMOS SRAM  
10.2.3 Device class designator.  
Device class  
Device requirements documentation  
Q or V  
Certification and qualification to the die requirements of MIL-PRF-38535  
10.2.4 Die code. The die code designator shall be a number 6 for all devices supplied as die only with no case outline.  
10.2.5. Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions,  
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for  
each product and variant supplied to this appendix.  
SIZE  
STANDARD  
5962-89598  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
L
SHEET  
46  
DSCC FORM 2234  
APR 97  
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