Electrical characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Wakeup time from low-power mode
The wakeup times given in Table 26 is measured on a wakeup phase with a 8-MHz HSI RC
oscillator. The clock source used to wake up the device depends from the current operating
mode:
●
Stop or Standby mode: the clock source is the RC oscillator
●
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
All timings are derived from tests performed under ambient temperature and V supply
DD
voltage conditions summarized in Table 9.
Table 26. Low-power mode wakeup timings
Symbol
Parameter
Conditions
Typ Unit
(1)
Wakeup from Sleep mode
Wakeup on HSI RC clock
1.8
3.6
µs
tWUSLEEP
Wakeup from Stop mode
(regulator in run mode)
HSI RC wakeup time = 2 µs
(1)
µs
tWUSTOP
HSI RC wakeup time = 2 µs,
Regulator wakeup from LP mode
time = 5 µs
Wakeup from Stop mode
(regulator in low power mode)
5.4
50
HSI RC wakeup time = 2 µs,
Regulator wakeup from power down
time = 38 µs
(1)
Wakeup from Standby mode
µs
tWUSTDBY
1. The wakeup times are measured from the wakeup event to the point in which the user application code
reads the first instruction.
5.3.8
PLL characteristics
The parameters given in Table 27 are derived from tests performed under ambient
temperature and V supply voltage conditions summarized in Table 9.
DD
Table 27. PLL characteristics
Value
Symbol
Parameter
Test conditions
Unit
Min
Typ
Max(1)
PLL input clock
8.0
MHz
%
fPLL_IN
PLL input clock duty cycle
PLL multiplier output clock
PLL lock time
40
16
60
72
fPLL_OUT
tLOCK
MHz
µs
200
1. Data based on device characterization, not tested in production.
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