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CY28412OCT 参数 Datasheet PDF下载

CY28412OCT图片预览
型号: CY28412OCT
PDF下载: 下载PDF文件 查看货源
内容描述: 时钟发生器Intel㈢的Grantsdale芯片组 [Clock Generator for Intel㈢ Grantsdale Chipset]
分类和应用: 时钟发生器
文件页数/大小: 16 页 / 205 K
品牌: SPECTRALINEAR [ SPECTRALINEAR INC ]
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CY28412  
Figure 1. Crystal Capacitive Clarification  
PD (Power-down) Clarification  
Calculating Load Capacitors  
The VTT_PWRGD# /PD pin is a dual function pin. During initial  
power-up, the pin functions as VTT_PWRGD#. Once  
VTT_PWRGD# has been sampled low by the clock chip, the  
pin assumes PD functionality. The PD pin is an asynchronous  
active high input used to shut off all clocks cleanly prior to  
shutting off power to the device. This signal is synchronized  
internal to the device prior to powering down the clock synthe-  
sizer. PD is also an asynchronous input for powering up the  
system. When PD is asserted high, all clocks are driven to a  
low value and held prior to turning off the VCOs and the crystal  
oscillator.  
In addition to the standard external trim capacitors, trace  
capacitance and pin capacitance must also be considered to  
correctly calculate crystal loading. As mentioned previously,  
the capacitance on each side of the crystal is in series with the  
crystal. This means the total capacitance on each side of the  
crystal must be twice the specified crystal load capacitance  
(CL). While the capacitance on each side of the crystal is in  
series with the crystal, trim capacitors (Ce1,Ce2) should be  
calculated to provide equal capacitive loading on both sides.  
As mentioned previously, the capacitance on each side of the  
crystal is in series with the crystal. This mean the total capac-  
itance on each side of the crystal must be 2 times the specified  
load capacitance (CL). While the capacitance on each side of  
the crystal is in series with the crystal, trim capacitors  
(Ce1,Ce2) should be calculated to provide equal capacitance  
loading on both sides.  
PD (Power-down) – Assertion  
When PD is sampled high by two consecutive rising edges of  
CPUC, all single-ended outputs will be held low on their next  
high to low transition and differential clocks must be held high  
or Hi-Z (depending on the state of the control register drive  
mode bit) on the next diff clock# high to low transition. When  
the SMBus PD drive mode bit corresponding to the differential  
(CPU, SRC, and DOT) clock output of interest is programmed  
to ‘0’, the clock output must be held with “Diff clock” pin driven  
high at 2 x Iref, and “Diff clock#” tristate. If the control register  
PD drive mode bit corresponding to the output of interest is  
programmed to “1”, then both the “Diff clock” and the “Diff  
clock#” are Hi-Z. Note the example below shows CPUT = 133  
MHz and PD drive mode = ‘1’ for all differential outputs. This  
diagram and description is applicable to valid CPU  
frequencies 100,133,166,200,266,333, and 400 MHz. In the  
event that PD mode is desired as the initial power-on state, PD  
must be asserted high in less than 10 Ps after asserting  
VTT_PWRGD#.  
Use the following formulas to calculate the trim capacitor  
values for Ce1 and Ce2.  
Load Capacitance (each side)  
Ce = 2 * CL – (Cs + Ci)  
Total Capacitance (as seen by the crystal)  
1
CLe  
=
1
Ce2 + Cs2 + Ci2  
1
Ce1 + Cs1 + Ci1  
(
)
+
CL ................................................... Crystal load capacitance  
CLe .........................................Actual loading seen by crystal  
using standard value trim capacitors  
Ce .....................................................External trim capacitors  
Cs ............................................. Stray capacitance (terraced)  
Ci .......................................................... Internal capacitance  
(lead frame, bond wires etc.)  
Rev 1.0,November 20, 2006  
Page 8 of 16