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S71GL064A80BAI0F3 参数 Datasheet PDF下载

S71GL064A80BAI0F3图片预览
型号: S71GL064A80BAI0F3
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP )闪存和RAM [Stacked Multi-Chip Product (MCP) Flash Memory and RAM]
分类和应用: 闪存
文件页数/大小: 102 页 / 1762 K
品牌: SPANSION [ SPANSION ]
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A d v a n c e I n f o r m a t i o n  
Erase And Programming Performance  
Max  
Parameter  
Typ (Note 1)  
(Note 2)  
Unit  
Comments  
Sector Erase Time  
0.5  
32  
3.5  
64  
Excludes 00h  
programming  
prior to erasure  
(Note 6)  
S29GL032A  
S29GL064A  
sec  
Chip Erase Time  
64  
128  
Total Write Buffer Program Time (Notes 3, 5)  
240  
µs  
µs  
Total Accelerated Effective Write Buffer Program Time  
(Notes 4, 5)  
Excludes system  
level overhead  
(Note 7)  
200  
S29GL032A  
S29GL064A  
31.5  
63  
Chip Program Time  
sec  
Notes:  
1. Typical program and erase times assume the following conditions: 25°C, V = 3.0V, 10,000 cycles; checkerboard  
CC  
data pattern.  
2. Under worst case conditions of 90°C; Worst case V , 100,000 cycles.  
CC  
3. Effective programming time (typ) is 15 µs (per word), 7.5 µs (per byte).  
4. Effective accelerated programming time (typ) is 12.5 µs (per word), 6.3 µs (per byte).  
5. Effective write buffer specification is calculated on a per-word/per-byte basis for a 16-word/32-byte write buffer  
operation.  
6. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure.  
7. System-level overhead is the time required to execute the command sequence(s) for the program command. See  
Table 22 for further information on command definitions.  
80  
S71GL032A Based MCPs  
S71GL032A_00_A0 March 31, 2005  
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