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S71GL064A80BAI0F3 参数 Datasheet PDF下载

S71GL064A80BAI0F3图片预览
型号: S71GL064A80BAI0F3
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP )闪存和RAM [Stacked Multi-Chip Product (MCP) Flash Memory and RAM]
分类和应用: 闪存
文件页数/大小: 102 页 / 1762 K
品牌: SPANSION [ SPANSION ]
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A d v a n c e I n f o r m a t i o n  
PBA for program  
2AA for erase  
SA for program buffer to flash  
SA for sector erase  
555 for chip erase  
Data# Polling  
Addresses  
PA  
tWC  
tWH  
tAS  
tAH  
WE#  
OE#  
tPOLL  
tGHEL  
tWHWH1 or 2  
tCP  
CE#  
Data  
tWS  
tCPH  
tDS  
tBUSY  
tDH  
DQ7#  
DOUT  
tRH  
PBD for program 29 for program buffer to flash  
55 for erase  
30 for sector erase  
10 for chip erase  
RESET#  
RY/BY#  
Notes:  
1. Figure indicates last two bus cycles of a program or erase operation.  
2. PA = program address, SA = sector address, PD = program data.  
3. DQ7# is the complement of the data written to the device. D  
4. Illustration shows device in word mode.  
is the data written to the device.  
OUT  
Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings  
March 31, 2005 S71GL032A_00_A0  
S71GL032A Based MCPs  
79  
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