High Performance Two Port 10/100 Managed Ethernet Switch with 32-Bit Non-PCI CPU Interface
Datasheet
Table 16.2 LAN9312 128-XVTQFP Dimensions
MIN
NOMINAL
MAX
REMARKS
A
A1
-
-
1.20
0.15
1.05
16.20
14.20
6.65
0.75
0.23
0.20
Overall Package Height
Standoff
0.05
0.95
15.80
13.80
6.35
0.45
0.13
0.09
-
1.00
16.00
14.00
6.50
0.60
0.18
-
A2
Body Thickness
X/Y Span
D/E
D1/E1
D2/E2
L
X/Y Plastic Body Size
X/Y Exposed Pad Size
Lead Foot Length
Lead Width
b
c
Lead Foot Thickness
Lead Pitch
e
0.40 BSC
-
ddd
ccc
0.00
-
0.07
0.08
True Position Spread
Coplanarity
-
Notes:
1. All dimensions are in millimeters unless otherwise noted.
2. Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The
base metal is exposed at the lead tip.
3. Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1
and E1 are maximum plastic body size dimensions including mold mismatch.
4. Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the
bottom of the package within 0.05mm.
5. The pin 1 identifier may vary, but is always located within the zone indicated
.
Figure 16.4 LAN9312 128-XVTQFP Recommended PCB Land Pattern
Revision 1.2 (04-08-08)
458
SMSC LAN9312
DATASHEET
SMSC [ SMSC CORPORATION ]
