SiI 1160 PanelLink Transmitter
Data Sheet
Package Dimensions
Package
100-pin TQFP Package Dimensions and Marking Specification
L1
JEDEC Package Code MS-026-AED
typ
max
1.20
0.15
1.05
Thickness
A
A1
A2
D1
E1
F1
G1
L1
b
Stand-off
Body Thickness
Body Size
1.00
14.00
14.00
16.00
16.00
1.00
TMDS™
Body Size
E1
F1
Footprint
Footprint
Device #
Lot #
Date Code
Trace Code
SiI1160CTU
LLLLLL.LLLL
YYWW
Lead Length
Lead Width
Lead Thickness
Lead Pitch
0.20
TTTTTTm
0.20
c
0.50
e
Dimensions in millimeters.
Overall thickness A=A1+A2.
D1
G1
Package: SiI1160CTU
c
Legend
Description
A2
LLLLLL.LLLL
Lot Number
Year of Mfr
Week of Mfr
Trace Code
YY
A1
WW
TTTTTT
m
b
e
Maturity Code
=0: engineering
samples
=1: pre-production
>1: production
Figure 22. 100-pin TQFP Package Dimensions (JEDEC code MS-026-AED)
Ordering Information
Standard Part Number: SiI1160CTU
(‘U’ indicates Universal package usable in both standard and lead-free environments)
SiI-DS-0126-B
28
SILICONIMAGE [ Silicon image ]
