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K9XXG16UXM-Y 参数 Datasheet PDF下载

K9XXG16UXM-Y图片预览
型号: K9XXG16UXM-Y
PDF下载: 下载PDF文件 查看货源
内容描述: 256M ×8位/ 128M x 16位NAND闪存 [256M x 8 Bit / 128M x 16 Bit NAND Flash Memory]
分类和应用: 闪存
文件页数/大小: 39 页 / 679 K
品牌: SAMSUNG [ SAMSUNG ]
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K9W4G08U1M  
K9K2G08Q0M  
K9K2G08U0M  
K9W4G16U1M  
K9K2G16Q0M  
K9K2G16U0M  
FLASH MEMORY  
READY/BUSY  
The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random  
read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command regis-  
ter or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is  
an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B) and  
current drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig 17). Its value can be  
determined by the following guidance.  
Rp  
ibusy  
VCC  
1.8V device - VOL : 0.1V, VOH : VCCq-0.1V  
3.3V device - VOL : 0.4V, VOH : 2.4V  
Ready Vcc  
R/B  
open drain output  
VOH  
CL  
VOL  
Busy  
tf  
tr  
GND  
Device  
Figure 17. Rp vs tr ,tf & Rp vs ibusy  
@ Vcc = 1.8V, Ta = 25°C , CL = 30pF  
@ Vcc = 3.3V, Ta = 25°C , CL = 100pF  
400  
2.4  
Ibusy  
Ibusy  
300n  
3m  
300n  
3m  
300  
1.2  
1.7  
200n  
100n  
2m  
1m  
200n  
100n  
200  
0.8  
2m  
1m  
120  
0.85  
60  
90  
tr  
tr  
30  
100  
3.6  
0.6  
3.6  
0.57  
1.7  
0.43  
3.6  
2K  
3.6  
tf  
1.7  
1.7  
2K  
tf  
1.7  
4K  
1K  
3K  
4K  
1K  
3K  
Rp(ohm)  
Rp(ohm)  
Rp value guidance  
VCC(Max.) - VOL(Max.)  
1.85V  
Rp(min, 1.8V part) =  
=
3mA + ΣIL  
IOL + ΣIL  
VCC(Max.) - VOL(Max.)  
3.2V  
Rp(min, 3.3V part) =  
=
IOL + ΣIL  
8mA + ΣIL  
where IL is the sum of the input currents of all devices tied to the R/B pin.  
Rp(max) is determined by maximum permissible limit of tr  
38  
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