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K9F5616Q0B-DIB0 参数 Datasheet PDF下载

K9F5616Q0B-DIB0图片预览
型号: K9F5616Q0B-DIB0
PDF下载: 下载PDF文件 查看货源
内容描述: 32M ×8位, 16M x 16位NAND闪存 [32M x 8 Bit , 16M x 16 Bit NAND Flash Memory]
分类和应用: 闪存
文件页数/大小: 34 页 / 602 K
品牌: SAMSUNG [ SAMSUNG ]
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K9F5608U0B-VCB0,VIB0,FCB0,FIB0  
K9F5608Q0B-DCB0,DIB0,HCB0,HIB0  
K9F5608U0B-YCB0,YIB0,PCB0,PIB0  
K9F5608U0B-DCB0,DIB0,HCB0,HIB0  
K9F5616Q0B-DCB0,DIB0,HCB0,HIB0  
K9F5616U0B-YCB0,YIB0,PCB0,PIB0  
K9F5616U0B-DCB0,DIB0,HCB0,HIB0  
FLASH MEMORY  
PRODUCT INTRODUCTION  
The K9F56XXX0B is a 264Mbit(276,824,064 bit) memory organized as 65,536 rows(pages) by 528(X8 device) or 264(X16 device)  
columns. Spare eight columns are located from column address of 512~527(X8 device) or 256~263(X16 device). A 528-byte(X8  
device) or 264-word(X16 device) data register is connected to memory cell arrays accommodating data transfer between the I/O  
buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially con-  
nected to form a NAND structure. Each of the 16 cells resides in a different page. A block consists of two NAND structures. A NAND  
structure consists of 16 cells. Total 16896 NAND cells reside in a block. The array organization is shown in Figure 2-1,2-2. The pro-  
gram and read operations are executed on a page basis, while the erase operation is executed on a block basis. The memory array  
consists of 2048 separately erasable 16K-Byte(X8 device) or 8K-Word(X16 device) blocks. It indicates that the bit by bit erase oper-  
ation is prohibited on the K9F56XXX0B.  
The K9F56XXX0B has addresses multiplexed into 8 I/Os(X16 device case: lower 8 I/Os). K9F5616X0B allows sixteen bit wide data  
transport into and out of page registers. This scheme dramatically reduces pin counts while providing high performance and allows  
systems upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written  
through I/O¢s by bringing WE to low while CE is low. Data is latched on the rising edge of WE. Command Latch Enable(CLE) and  
Address Latch Enable(ALE) are used to multiplex command and address respectively, via the I/O pins. Some commands require one  
bus cycle. For example, Reset command, Read command, Status Read command, etc require just one cycle bus. Some other com-  
mands like Page Program and Copy-back Program and Block Erase, require two cycles: one cycle for setup and the other cycle for  
execution. The 32M-byte(X8 device) or 16M-word(X16 device) physical space requires 24 addresses, thereby requiring three cycles  
for word-level addressing: column address, low row address and high row address, in that order. Page Read and Page Program  
need the same three address cycles following the required command input. In Block Erase operation, however, only the two row  
address cycles are used. Device operations are selected by writing specific commands into the command register. Table 1 defines  
the specific commands of the K9F56XXX0B.  
The device includes one block sized OTP(One Time Programmable), which can be used to increase system security or to provide  
identification capabilities. Detailed information can be obtained by contact with Samsung.  
Table 1. COMMAND SETS  
Function  
1st. Cycle  
00h/01h(1)  
50h  
2nd. Cycle  
Acceptable Command during Busy  
Read 1  
Read 2  
Read ID  
Reset  
-
-
-
90h  
FFh  
-
O
O
Page Program  
Copy-Back Program  
Block Erase  
80h  
10h  
8Ah  
D0h  
-
00h  
60h  
Read Status  
70h  
NOTE : 1. The 01h command is available only on X8 device(K9F5608X0B).  
Caution : Any undefined command inputs are prohibited except for above command set of Table 1.  
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