64M DDR SDRAM
K4D623238B-GC
512K x 32Bit x 4 Banks Double Data Rate Synchronous RAM
with Bi-directional Data Strobe and DLL
FEATURES
• 2.5V + 5% power supply for device operation
• 4 DQS’ s ( 1DQS / Byte )
• VDD/VDDQ = 2.8V ± 5% for -33
• Data I/O transactions on both edges of Data strobe
• DLL aligns DQ and DQS transitions with Clock transition
• Edge aligned data & data strobe output
• Center aligned data & data strobe input
• DM for write masking only
• VDD/VDDQ = 2.5V ± 5% for -60/-55/-50/-45/-40
• SSTL_2 compatible inputs/outputs
• 4 banks operation
• MRS cycle with address key programs
-. Read latency 3,4,5 (clock)
• Auto & Self refresh
-. Burst length (2, 4, 8 and Full page)
-. Burst type (sequential & interleave)
• Full page burst length for sequential burst type only
• Start address of the full page burst should be even
• All inputs except data & DM are sampled at the positive
going edge of the system clock
• 16ms refresh period (2K cycle)
• 144-Ball FBGA
• Maximum clock frequency up to 300MHz
• Maximum data rate up to 600Mbps/pin
• Differential clock input
• No Wrtie-Interrupted by Read Function
ORDERING INFORMATION
Part NO.
Max Freq.
300MHz
250MHz
222MHz
200MHz
183MHz
166MHz
Max Data Rate
600Mbps/pin
500Mbps/pin
444Mbps/pin
400Mbps/pin
366Mbps/pin
333Mbps/pin
Interface
Package
K4D623238B-GC/L33
K4D623238B-GC/L40
K4D623238B-GC/L45
K4D623238B-GC/L50
K4D623238B-GC/L55
K4D623238B-GC/L60
SSTL_2
144-Ball FBGA
GENERAL DESCRIPTION
FOR 512K x 32Bit x 4 Bank DDR SDRAM
The K4D623238 is 67,108,864 bits of hyper synchronous data rate Dynamic RAM organized as 2 x1,048,976 words by 32
bits, fabricated with SAMSUNG’s high performance CMOS technology. Synchronous features with Data Strobe allow
extremely high performance up to 2.4GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of
operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety
of high performance memory system applications.
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Rev. 1.4 (Sep. 2002)