Internet Data Sheet
HYB18H1G321AF–10/11/14
1-Gbit GDDR3
6
Package
6.1
Package Outline
FIGURE 20
Package Outline PG-TFBGA-136-059
ꢂꢅ
ꢄꢃꢂꢈ -!8ꢃ
ꢄꢃꢂꢀ -!8ꢃ
ꢂꢉ X ꢄꢃꢈ ꢊ ꢂꢀꢃꢈ
ꢄꢃꢈ
ꢄꢃꢀ
ꢀꢁ
"
ꢀꢁ
ꢆꢁ
ꢅꢁ
ꢇꢁ
ꢂꢁ
!
ꢄꢃꢂ
#
ꢄꢃꢂ
#
ꢂꢇꢉX
ꢉꢁ
ꢄꢃꢄꢆ
ꢄꢃꢅꢆ
-
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! "
3%!4).' 0,!.%
#
#
#
-
ꢄꢃꢄꢈ
,EAD FREE SOLDER BALLS ꢍGREEN SOLDER BALLSꢁ
ꢂꢁ "AD UNIT MARKING ꢍ"5-ꢁ ꢍLIGHT ꢊ GOODꢁ
ꢀꢁ -IDDLE OF PACKAGES EDGES
ꢇꢁ 0ACKAGE ORIENTATION MARK !ꢂ
ꢅꢁ 3"!ꢋFIDUCIAL ꢍSOLDER BALL ATTACHꢁ
ꢆꢁ "ARE CORE AREA
ꢉꢁ 3OLDER BALL DIAMETER REFERS TO POST REFLOW CONDITIONS
&0/?0'ꢋ4&"'!??ꢋꢂꢇꢉꢋꢄꢆꢌ
Note: The package is conforming with JEDEC MO-207i, VAR DR-z.
Rev. 0.92, 2007-10
42
06122007-MW7D-3G3M
QIMONDA [ QIMONDA AG ]
