Internet Data Sheet
HYB18H1G321AF–10/11/14
1-Gbit GDDR3
6.2
Package Thermal Characteristics
TABLE 23
PG-TFBGA-136 Package Thermal Resistances
Theta_jA
Theta_jB
Theta_jC
JEDEC Board
Air Flow
K/W
1s0p
0 m/s
40
2s0p
0 m/s
22
1 m/s
32
3 m/s
27
1 m/s
19
3 m/s
17
-
-
5
2
Notes
1. Theta_jA: Junction to Ambient thermal resistance. The values have been obtained by simulation using the conditions stated
in the JEDEC JESD-51 standard.
2. Theta_jB: Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC: Junction to Case thermal resistance. The value has been obtained by simulation.
Rev. 0.92, 2007-10
43
06122007-MW7D-3G3M
QIMONDA [ QIMONDA AG ]
