Internet Data Sheet
HYB18T512161BF–20/22/25/28/33
512-Mbit Double-Data-Rate-Two SDRAM
1
Overview
This chapter gives an overview of the 512-Mbit Double-Data-Rate-Two SDRAM product family for graphics application and
describes its main characteristics.
1.1
Features
The 512-Mbit Double-Data-Rate-Two SDRAM offers the following key features:
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1.8 V ± 0.1V VDD for [–25/–28/–33]
2.0 V ± 0.1V VDD for [–20/–22]
1.8 V ± 0.1V VDDQ for [–25/–28/–33]
2.0 V ± 0.1V VDDQ for [–20/–22]
DRAM organizations with 16 data in/outputs
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Commands entered on each positive clock edge, data and
data mask are referenced to both edges of DQS
Data masks (DM) for write data
Posted CAS by programmable additive latency for better
command and data bus efficiency
Off-Chip-Driver impedance adjustment (OCD) and On-
Die-Termination (ODT) for better signal quality.
Auto-Precharge operation for read and write bursts
Auto-Refresh, Self-Refresh and power saving Power-
Down modes
Average Refresh Period 7.8 µs at a TCASE lower than
85 °C, 3.9 µs between 85 °C and 95 °C
Full Strength and reduced Strength (60%) Data-Output
Drivers
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Double Data Rate architecture:
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– two data transfers per clock cycle
– four internal banks for concurrent operation
Programmable CAS Latency: 3, 4, 5, 6, 7
Programmable Burst Length: 4 and 8
Differential clock inputs (CK and CK)
Bi-directional, differential data strobes (DQS and DQS) are
transmitted / received with data. Edge aligned with read
data and center-aligned with write data.
DLL aligns DQ and DQS transitions with clock
DQS can be disabled for single-ended data strobe
operation
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2kB page size
Packages: P-TFBGA-84 for ×16 components
RoHS Compliant Products1)
TABLE 1
Ordering Information for RoHS compliant products
Product Number
Org.
Clock (MHz)
Package
HYB18T512161BF–20/22/25/28/33
×16
500/450/400/350/300
P-TFBGA-84
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.43, 2006-11
3
03292006-L40N-L04G
QIMONDA [ QIMONDA AG ]
