TOP242-250
ABSOLUTE MAXIMUM RATINGS(1)
DRAIN Voltage ..................................................-0.3Vto700V CONTROL Current .................................................... 100 mA
DRAIN Peak Current: TOP242......................................0.72 A LINE SENSE Pin Voltage ...................................-0.3 V to 9 V
TOP243.......................................1.44 A CURRENT LIMIT Pin Voltage ........................-0.3 V to 4.5 V
TOP244..........................................2.16A MULTI-FUNCTION Pin Voltage ........................-0.3 V to 9 V
TOP245.......................................2.88 A FREQUENCY Pin Voltage ..................................-0.3 V to 9 V
TOP246..........................................4.32 A Storage Temperature ..................................... -65 °C to 150 °C
TOP247..........................................5.76 A Operating Junction Temperature(2) ................ -40 °C to 150 °C
TOP248..........................................7.20 A Lead Temperature(3) ...................................................... 260 °C
TOP249..........................................8.64 A Notes:
TOP250........................................10.08A 1. All voltages referenced to SOURCE, TA = 25 °C.
CONTROLVoltage ................................................ -0.3Vto 9V 2. Normally limited by internal circuitry.
3. 1/16 in. from case for 5 seconds.
THERMAL IMPEDANCE
Thermal Impedance: Y or F Package:
Notes:
(θJA)(1) ...............................................80 °C/W 1. Free standing with no heatsink.
(θJC)(2) .................................................2 °C/W 2. Measured at the back surface of tab.
P or G Package:
3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2)
(θJA) ............................ 70 °C/W(3); 60 °C/W(4)
copper clad.
(θJC)(5)................................................ 11 °C/W 4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
R Package:
5. Measured on the SOURCE pin close to plastic interface.
(θJA) ..........80 °C/W(7);40 °C/W(4); 30 °C/W(6) 6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad.
(θJC)(5)..................................................2 °C/W 7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
Parameter
Symbol
Min
Typ
Max
Units
See Figure 53
(Unless Otherwise Specified)
CONTROL FUNCTIONS
FREQUENCY Pin
Connected to SOURCE
124
132
66
140
Switching
Frequency
(average)
IC = 3 mA;
TJ = 25 °C
fOSC
kHz
FREQUENCY Pin
Connected to CONTROL
61.5
70.5
Duty Cycle at
ONSET of
Frequency
Reduction
DC(ONSET)
10
%
Switching
Frequency near
0% Duty Cycle
132 kHz Operation
66 kHz Operation
30
15
fOSC(DMIN)
kHz
132 kHz Operation
66 kHz Operation
±4
±2
Frequency Jitter
Deviation
∆f
kHz
Hz
Frequency Jitter
Modulation Rate
fM
250
M
12/04
33
POWERINT [ Power Integrations ]
