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TOP245PN- 参数 Datasheet PDF下载

TOP245PN-图片预览
型号: TOP245PN-
PDF下载: 下载PDF文件 查看货源
内容描述: 的TOPSwitch -GX系列功率扩展,设计灵活, EcoSmart节能,集成离线式开关 [TOPSwitch-GX Family Extended Power, Design Flexible, EcoSmart, Integrated Off-line Switcher]
分类和应用: 开关
文件页数/大小: 52 页 / 2175 K
品牌: POWERINT [ Power Integrations ]
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TOP242-250  
SOURCE connection trace should not be shared by the main  
MOSFET switching currents. All SOURCE pin referenced  
components connected to the MULTI-FUNCTION, LINE-  
SENSE or EXTERNAL CURRENT LIMIT pins should  
also be located closely between their respective pin and  
SOURCE. Once again, the SOURCE connection trace of these  
components should not be shared by the main MOSFET  
switching currents. It is very critical that SOURCE pin  
switching currents are returned to the input capacitor negative  
terminal through a seperate trace that is not shared by the  
components connected to CONTROL, MULTI-FUNCTION,  
LINE-SENSE or EXTERNAL CURRENT LIMIT pins. This  
is because the SOURCE pin is also the controller ground  
reference pin.  
frequency radiated noise (for example, video noise sensitive  
applications such as VCR, DVD, monitor, TV, etc.), operating  
at 66 kHz will reduce snubber loss resulting in better efficiency.  
Also, in applications where transformer size is not a concern,  
use of the 66 kHz option will provide lower EMI and higher  
efficiency. Note that the second harmonic of 66 kHz is still  
below 150 kHz, above which the conducted EMI specifications  
get much tighter.  
For 10 W or below, it is possible to use a simple inductor in  
place of a more costly AC input common mode choke to meet  
worldwide conducted EMI limits.  
Transformer Design  
It is recommended that the transformer be designed for  
maximum operating flux density of 3000 Gauss and a peak flux  
densityof4200Gaussatmaximumcurrentlimit. Theturnsratio  
should be chosen for a reflected voltage (VOR) no greater than  
135 V when using a Zener clamp, or 150 V (max) when using  
an RCD clamp with current limit reduction with line voltage  
(overload protection).  
Any traces to the M, L or X pins should be kept as short as  
possible and away from the DRAIN trace to prevent noise  
coupling. LINE-SENSE resistor (R1 in Figures 47-49) should  
be located close to the M or L pin to minimize the trace length  
on the M or L pin side.  
In addition to the 47 µF CONTROL pin capacitor, a high  
frequency bypass capacitor in parallel may be used for better  
noise immunity. The feedback optocoupler output should  
also be located close to the CONTROL and SOURCE pins of  
TOPSwitch-GX.  
For designs where operating current is significantly lower than  
the default current limit, it is recommended to use an externally  
setcurrentlimitclosetotheoperatingpeakcurrenttoreducepeak  
flux density and peak power (see Figures 20 and 34). In most  
applications,thetightercurrentlimittolerance,higherswitching  
frequency and soft-start features of TOPSwitch-GX contribute  
to a smaller transformer when compared to TOPSwitch-II.  
Y-Capacitor  
The Y-capacitor should be connected close to the secondary  
output return pin(s) and the positive primary DC input pin of  
the transformer.  
Standby Consumption  
Frequency reduction can significantly reduce power loss at  
light or no load, especially when a Zener clamp is used. For  
very low secondary power consumption, use aTL431 regulator  
for feedback control. Alternately, switching losses can be  
significantly reduced by changing from 132 kHz in normal  
operation to 66 kHz under light load conditions.  
Heat Sinking  
The tab of the Y package (TO-220) or F package (TO-262)  
is internally electrically tied to the SOURCE pin. To avoid  
circulating currents, a heat sink attached to the tab should not  
be electrically tied to any primary ground/source nodes on the  
PC board.  
TOPSwitch-GX Layout Considerations  
When using a P (DIP-8), G (SMD-8) or R (TO-263) package,  
a copper area underneath the package connected to the  
SOURCE pins will act as an effective heat sink. On double  
sided boards (Figure 49), top side and bottom side areas  
connected with vias can be used to increase the effective heat  
sinking area.  
As TOPSwitch-GX has additional pins and operates at  
muchhigherpowerlevelscomparedtopreviousTOPSwitch  
families, the following guidelines should be carefully  
followed.  
Primary Side Connections  
In addition, sufficient copper area should be provided at  
the anode and cathode leads of the output diode(s) for heat  
sinking.  
Use a single point (Kelvin) connection at the negative terminal  
of the input filter capacitor for the TOPSwitch-GX SOURCE  
pin and bias winding return. This improves surge capabilities  
by returning surge currents from the bias winding directly to  
the input filter capacitor.  
In Figures 47, 48 and 49, a narrow trace is shown between  
the output rectifier and output filter capacitor. This trace acts  
as a thermal relief between the rectifier and filter capacitor to  
prevent excessive heating of the capacitor.  
The CONTROL pin bypass capacitor should be located as  
close as possible to the SOURCE and CONTROL pins and its  
M
30 12/04  
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