RELEASED
PM7350 S/UNI DUPLEX
DATA SHEET
PMC-1980581
ISSUE 8
DUAL SERIAL LINK PHY MULTIPLEXER
18
ORDERING AND THERMAL INFORMATION
PART NO.
PM7350-PI
DESCRIPTION
160-Pin PBGA, 15 x 15 mm, 1.86 mm, 1.00 mm BP
PM7350-PGI 160-Pin PBGA, 15 x 15 x 1.86 mm, 1.00 mm BP (RoHS-compliant)
This product is designed to operate over a wide temperature range and is suited for
outside plant equipment1.
Table 24 Outside Plant Thermal Information
Maximum long-term operating junction temperature (TJ) to ensure
adequate long-term life
[85] °C
Maximum junction temperature (TJ) for short-term excursions with
guaranteed continued functional performance2. This condition will typically
be reached when local ambient reaches 70 °C.
[114] °C
Minimum ambient temperature (TA)
[-40] °C
Table 25 Thermal Resistance vs.
Air Flow3
Top
Airflow
Natural
200
400
Device
Compact
Model
Convection
LFM
LFM
θJT
31.0
25.2
21.9
θJA
(°C/W)
Junction
θJB
Table 26 Device Compact Model4
Board
7.6 °C/W
19 °C/W
θJT
θJB
Notes
1. The minimum ambient temperature requirement for Outside Plant Equipment meets the minimum ambient
temperature requirement for Industrial Equipment
2. Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core; for more
information about this standard, see [6]
3.
θ
JA is the total junction to ambient thermal resistance as measured according to JEDEC Standard JESD51
(2S2P); for more information about this standard, see [7]
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
228
PMC [ PMC-SIERRA, INC ]
