STANDARD PRODUCT
PM4328 TECT3
DATASHEET
PMC-2011596
ISSUE 1
HIGH DENSITY T1/E1 FRAMER
AND M13 MULTIPLEXER
7
PIN DIAGRAM
The TECT3 is currently planned to be packaged in a 324-pin PBGA package
having a body size of 23mm by 23mm and a ball pitch of 1.0 mm. The center 36
balls are not used as signal I/Os and are thermal balls. Pin names and locations
are defined in the Pin Description Table in section 8. Mechanical information for
this package is in the section 19.
Figure 6: Pin Diagram
22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
B
C
D
E
F
G
324 PBGA
H
J
VSS VSS VSS VSS VSS VSS
VSS VSS VSS VSS VSS VSS
VSS VSS VSS VSS VSS VSS
VSS VSS VSS VSS VSS VSS
VSS VSS VSS VSS VSS VSS
VSS VSS VSS VSS VSS VSS
K
L
M
N
P
R
T
Bottom View
U
V
W
AB
22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
PROPRIETARY AND CONFIDENTIAL
25
PMC [ PMC-SIERRA, INC ]
