64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
2
3
4
5
6
7
8
9
48
47
46
45
44
43
42
41
40
GND_TXHS
TX[0]
RXCAP0
BYTSYNC
GND_RXTTL
RX[0]
TX[1]
TX[2]
TX[3]
RX[1]
TX[4]
RX[2]
TX[5]
V
_RXTTL
CC
HDMP-1638G
xxxx-x Rz.zz
TX[6]
RX[3]
RX[4]
RX[5]
RX[6]
TX[7]
TX[8]
10
11
12
13
14
15
16
39
38
37
36
35
34
33
TX[9]
e3
S
YYWW
NC
V
_RXTTL
CC
RXSEL
GND_TXTTL
GND_TXA
TXCAP1
RX[7]
RX[8]
RX[9]
GND_RXTTL
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
xxxx-x = WAFER LOT NUMBER–BUILD NUMBER
Rz.zz = DIE REVISION
S = SUPPLIER CODE
YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK)
COUNTRY = COUNTRY OF MANUFACTURE
(MARKED ON BACK OF DEVICE)
*NOTE: PINS 12 AND 27 ARE DESIGNATED AS "NO CONNECT" PINS
AND ARE NORMALLY UNCONNECTED.
e3 = JESD97 Pb-FREE CATEGORY.
Figure 11. HDMP-1638G (TRx) package layout and marking, top view.
12
PMC-Sierra, Inc. - Not Recommended for New Designs
PMC [ PMC-SIERRA, INC ]
