Philips Semiconductors
Product specification
VHF power transistor
BLV25
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 6 leads
SOT119A
A
F
B
q
C
U
1
w
2
H
1
M
C
b
2
c
2
4
6
p
H
D
U
D
U
1
3
2
w
M
A
B
1
A
1
3
5
b
w
3
b
M
Q
1
e
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
c
A
b
b
b
D
D
e
F
H
H
p
Q
q
U
U
U
w
w
w
3
UNIT
mm
1
2
1
1
1
2
3
1
2
5.59
5.33
7.39
6.32
5.34 4.07
5.08 3.81
12.86 12.83
12.59 12.57
2.54 22.10 18.55 3.31 4.58
2.28 21.08 18.28 2.97 3.98
25.23 6.48 12.76
23.95 6.07 12.06
0.18
0.07
18.42
0.725
0.51 1.02 0.26
0.02 0.04 0.01
6.48
0.255
0.220
0.210
0.291
0.249
0.160
0.150
0.505 0.505
0.496 0.495
0.100 0.870 0.730 0.130 0.180
0.090 0.830 0.720 0.117 0.157
0.255 0.502
0.239 0.475
0.210
0.200
0.007
0.003
0.993
0.943
inches
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT119A
97-06-28
August 1986
10
NXP [ NXP ]
