NCP5316
PACKAGE DIMENSIONS
LQFP−48
FTB SUFFIX
CASE 932−02
ISSUE E
4X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.200 AB T−U
Z
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
DETAIL Y
P
9
A
A1
48
37
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
1
36
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
T
U
B
V
AE
AE
B1
V1
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
12
25
MILLIMETERS
13
24
DIM MIN
MAX
7.000 BSC
3.500 BSC
Z
A
A1
B
S1
7.000 BSC
3.500 BSC
T, U, Z
B1
C
1.400
1.600
0.270
1.450
0.230
S
D
0.170
1.350
0.170
DETAIL Y
4X
E
F
0.200 AC T−U
Z
G
H
0.500 BSC
0.050
0.090
0.500
1
0.150
0.200
0.700
5
J
K
L
_
_
0.080 AC
M
N
12 REF
_
G
AB
AC
0.090
0.160
P
0.250 BSC
R
0.150
0.250
S
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
S1
V
V1
W
AA
AD
_
M
BASE METAL
TOP & BOTTOM
R
N
J
E
C
F
D
M
0.080
AC T−U Z
SECTION AE−AE
W
H
_
L
K
DETAIL AD
AA
http://onsemi.com
30